Characterization of a Large-Scale Nondoped YBa2Cu3O7−x Superconductor Prepared by Plastic Forming Without High-Pressure Molding
Characterization of a Large-Scale Nondoped YBa2Cu3O7−x Superconductor Prepared by Plastic Forming Without High-Pressure Molding
复制标题
无需高压成型的塑性成型制备的大规模非掺杂 YBa2Cu3O7−x 超导体的表征
DOI：
10.1111/j.1551-2916.2007.01722.x
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发表时间：
2007
影响因子：
3.9
通讯作者：
M. Matsubara
中科院分区：
文献类型：
--
作者：
M. Takahashi;Y. Tomioka;Toshiyuki Miyauchi;Shoji Sato;Asami Murai;T. Ido;K. Wakita;H. Terada;S. Ohkido;M. Matsubara
制备含有YBa2Cu3O7-x颗粒和细YBa2Cu3(OH)x胶体溶液的浆料，并通过塑性成型而不是高压成型来生产大型块状YBa2Cu3O7-x超导体（约50毫米×35毫米×2毫米）。将浆料模制的样品干燥，然后在空气中于 1223 K 下烧制。 X射线衍射数据表明样品具有特征性的斜方YBa2Cu3O7−x结构。通过标准四探针直流电测量在 300 至 50 K 之间进行电阻测量。样品在92 K左右开始超导，全转变温度（临界温度）（Tc）为88.7±1.4 K。77 K时测得的临界电流密度（Jc）约为440 A/cm2，通过氧气氛下的热处理提高了Jc值，观察到Jc=1.6×103 A/cm2。在磁场（B=1T）下，样品保持其超导性，并证明该方法可用于产生用于磁共振成像诊断的磁屏蔽。
A slurry containing YBa2Cu3O7−x particles and a fine YBa2Cu3(OH)x colloid solution was prepared, and a large-scale bulk YBa2Cu3O7−x superconductor (about 50 mm × 35 mm × 2 mm) was produced by plastic forming without high-pressure molding. The samples molded from the slurry were dried and then fired at 1223 K in air. X-ray diffraction data indicated that the samples had the characteristic orthorhombic YBa2Cu3O7−x structure. Measurements of electrical resistance were carried out between 300 and 50 K by the standard four-probe DC electrical measurement. The samples began superconducting at an onset temperature around 92 K, and the full-transition temperature (critical temperature) (Tc) was 88.7±1.4 K. The critical current density (Jc) measured at 77 K was about 440 A/cm2, the value of Jc was improved by the heat treatment under an oxygen atmosphere, and Jc=1.6 × 103 A/cm2 was observed. Under the magnetic field (B=1 T), the sample held its superconductivity, and demonstrated that this method can be used to produce the magnetic shielding used in magnetic resonance imaging diagnosis.
溶胶-凝胶法制备高质量化学计量LiNbO_3厚膜并表征
DOI：
--
发表时间：
2004
期刊：
Thin Solid Films 458・1/2
影响因子：
--
作者：
L.Zhou;H.Ohkubo;J.Shimizu;H.Eda;M.Takahashi
通讯作者：
M.Takahashi