Electroless deposition of platinum on titanium substrates
Electroless deposition of platinum on titanium substrates
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DOI:
10.1016/s0254-0584(00)00268-6
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发表时间:
2001-02
影响因子:
4.6
通讯作者:
C. R. Rao;M. Pushpavanam
中科院分区:
文献类型:
--
作者:
C. R. Rao;M. Pushpavanam
The use of an electroless platinum bath based on chloroplatinic acid and hydrazine for depositing adherent and uniform layers on titanium panels is demonstrated. The conditions were optimised for a new set of additives. The effect of concentrations of platinum metal in the bath on thickness of the deposit was studied. The deposition rates on titanium and gold-plated titanium are evaluated. Dispersed platinum coatings on titanium powder were successfully obtained.