Energy efficiency comparison of nanowire heterojunction TFET and Si MOSFET at Lg=13nm, including P-TFET and variation considerations
Energy efficiency comparison of nanowire heterojunction TFET and Si MOSFET at Lg=13nm, including P-TFET and variation considerations
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DOI:
10.1109/iedm.2013.6724744
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发表时间:
2013-12
期刊:
影响因子:
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通讯作者:
U. Avci;D. Morris;S. Hasan;R. Kotlyar;Raseong Kim;R. Rios;D. Nikonov;I. Young
中科院分区:
文献类型:
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作者:
U. Avci;D. Morris;S. Hasan;R. Kotlyar;Raseong Kim;R. Rios;D. Nikonov;I. Young
Reducing supply voltage (Vdd) while keeping leakage current low is critical for minimizing energy consumption and improving mobile device battery life. The thermal limit of MOSFET subthreshold slope (SS) restricts lowering threshold voltage (Vt), causing significant performance degradation at low Vdd. A Tunneling Field Effect Transistor (TFET) is not limited by this thermal tail and may perform better at low Vdd [1,2]. In this paper, a leading N-TFET option - GaSb/InAs heterojunction - is atomistically modeled [3,4] and circuit simulation models are developed to predict 64% average energy savings against Si CMOS at Lg=13nm for a nanowire. Energy savings diminish to 21% without a good P-TFET option. Both MOSFET and TFET device variations are dominated by work-function variation, and TFET energy savings are slightly reduced when variations are considered.