Multiscale analysis on the onset of nanoindentation-induced delamination: Effect of high-modulus Ru overlayer
Multiscale analysis on the onset of nanoindentation-induced delamination: Effect of high-modulus Ru overlayer
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DOI：
10.1016/j.actamat.2009.05.018
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发表时间：
2009-08
期刊：
影响因子：
9.4
通讯作者：
S. Hara;T. Kumagai;S. Izumi;S. Sakai
中科院分区：
文献类型：
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作者：
S. Hara;T. Kumagai;S. Izumi;S. Sakai
本文提供了关于界面裂纹成核和扩展过程的原子级研究结果。为了观察Cu/SiO2的开裂情况，我们采用原子/连续耦合方法对Ru/Cu/SiO2体系进行了纳米压痕实验。我们发现界面裂纹形核是由异质位错形核触发的。由此产生的屈曲脱层模式是定性相似的实验观察到的。此外，通过与Cu/SiO2系统中的纳米压痕测试结果的比较，表明利用高模量Ru覆盖层的纳米压痕测试是评价Cu膜分层的有效探针。在具有Ru覆盖层的系统中，一旦裂纹成核，则裂纹以脆性方式沿着界面扩展。另一方面，在没有Ru覆盖层的情况下，裂纹扩展被显著延迟并且较少被驱动，这归因于在加载期间Cu膜中的大量塑性事件。这些结果将为解释实验结果提供清晰的物理图像。
This paper provides atomistic level findings regarding interfacial crack nucleation and propagation processes. To see the Cu/SiO2cracking, we carried out nanoindentations in the Ru/Cu/SiO2system using an atomistic/continuum coupling method. We found that interfacial crack nucleation is triggered by heterogeneous dislocation nucleation. The resulting buckling delamination mode is qualitatively similar to that observed experimentally. In addition, comparison with the nanoindentation in the Cu/SiO2system demonstrates that nanoindentation testing utilizing the high-modulus Ru overlayer is an effective probe for evaluating Cu film delamination. In the system with the Ru overlayer, the crack propagates along the interface in a brittle manner once the crack nucleates. On the other hand, without the Ru overlayer, crack propagation is significantly retarded and less driven, which is attributed to a large number of plastic events in the Cu film during loading. These results would provide a clear physical picture for explaining the experimental results.