The merits of open bath immersion cooling of datacom equipment

The merits of open bath immersion cooling of datacom equipment
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数据通信设备开放式浸没式冷却的优点

DOI:
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发表时间:
2010
期刊:
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)
影响因子:
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通讯作者:
P. Tuma
P. Tuma
中科院分区:
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文献类型:
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作者:
P. Tuma

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本文讨论了用于冷却数据通信设备(如服务器)的介电流体半开放浴中被动两相浸泡的经济和环境优点。该技术消除了通常与浸入式冷却相关的密封连接器、压力容器、密封件和翻盖,以及与更传统的液体冷却技术相关的连接器、填充、泵和冷板的需求。11.7W/cm2的板级功率密度可以在每千瓦100 cm3的流体下维持。模拟的模块化80千瓦浴槽可以通过水冷式冷凝器每平方米喷出130千瓦的地板空间。估计28°C的水在15 gpm下可以保持平均CPU结温,Tj<;60°C和62°C的水在30 gpm时可以保持Tj<;85°C,最大限度地利用热量用于其他目的。或者,热量可以直接传递到周围的空气,而不需要水作为中间物。发现与保守的年度流体排放估计相关的成本和温室气体排放低于与传统底盘风扇和液体泵所需电力相关的成本和温室气体排放。由于这些逃逸损失发生在一个点上,因此可以很容易地应用更有效的捕获技术。
This paper discusses the economic and environmental merits of passive 2-phase immersion in semi-open baths of dielectric fluid for cooling datacom equipment such as servers. The technique eliminates the need for hermetic connectors, pressure vessels, seals and clamshells typically associated with immersion cooling and the connectors, plumping, pumps and cold plates associated with more traditional liquid cooling techniques. A board level power density of 11.7W/cm2 can be sustained with 100 cm3 of fluid per kW. The modular 80 kW baths modeled can eject 130 kW per m2 of floor space via water-cooled condensers. It is estimated that 28°C water at 15 gpm could maintain average CPU junction temperatures, Tj<;60°C and 62°C water at 30 gpm could maintain Tj<;85°C, maximizing the availability of the heat for other purposes. Alternatively, the heat can be transferred directly to ambient air without water as an intermediate. The costs and greenhouse gas emissions associated with conservative annual fluid emission estimates are found to be less than those associated with the electrical power required for traditional chassis fans and liquid pumps. Since these fugitive losses occur at one point, more efficient capture techniques can be easily applied.