Metal foil RF micro-relay with integrated heat sink for high power applications
Metal foil RF micro-relay with integrated heat sink for high power applications
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DOI：
10.1109/memsys.2011.5734540
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发表时间：
2011-03
期刊：
影响因子：
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通讯作者：
F. M. Ozkeskin;S. Choi;K. Sarabandi;Y. Gianchandani
中科院分区：
文献类型：
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作者：
F. M. Ozkeskin;S. Choi;K. Sarabandi;Y. Gianchandani
本文报道了一种用于大功率射频应用的静电驱动欧姆接触微继电器。不锈钢悬臂式微型继电器与铂铑接触微机械加工从散装箔和组装在印刷电路板上。微加工铝散热器集成在接触点上方的杠杆上。这些设备的占地面积为2 x 3.2 mm 2。具有90 V导通电压的预制继电器可在1 GHz下承受10 W的入射RF功率，具有−0.25 dB的下态插入损耗和−37 dB的上态隔离。
This paper reports an electrostatically actuated ohmic contact micro-relay for high power RF applications. Stainless steel cantilevered micro-relays with platinum-rhodium contacts are micromachined from bulk foils and assembled on the printed circuit boards. Micromachined aluminum heat sinks are integrated on the cantilevers above the point of contact. The devices have a footprint of 2×3.2 mm2. Fabricated relays with 90 V turn-on voltage accommodate 10 W of incident RF power at 1 GHz with −0.25 dB of down-state insertion loss and −37 dB of up-state isolation.