Transient Liquid Phase Bonding
Transient Liquid Phase Bonding
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DOI：
10.21741/9781644900055
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发表时间：
2019-02
期刊：
影响因子：
--
通讯作者：
A. MacDonald;T. Eagar
中科院分区：
文献类型：
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作者：
A. MacDonald;T. Eagar
瞬态液相连接(TLP)是一种多年来应用于许多金属系统的连接工艺，但作为一种连接技术在航空航天和半导体应用中仍有希望。TLP工艺可生产出坚固、无界面、不残留粘结剂的接头。它与扩散连接的不同之处在于，由于形成了薄的液体中间层，因此不需要很高的粘接或夹紧力。中间层可以通过箔、电镀、溅射涂层或在衬底表面沉积薄膜的任何其他工艺来提供。如图1所示，该过程的示意图表明，通过将含有熔点降低剂(MPD)的合金金属的薄层放置在要连接的两块母金属之间并加热整个组件，形成了液体中间层。液态的形成可能是因为中间层的熔点已经超过，或者是因为与母体金属的反应导致了低熔点的液态合金。然后液体填充因交配不均匀而形成的空隙。
Transient liquid phase (TLP) bonding is a joining process that has been applied to many metallic systems throughout the ages, and yet it still holds promise as a technique for joining in aerospace and semiconductor applications. The TLP process produces a strong, interface-free joint with no remnant of the bonding agent. It differs from diffusion bonding in that the formation of a thin liquid interlayer eliminates the need for a high bonding or clamping force. The interlayer can be provided by foils, electroplate, sputter coats, or any other process that deposits a thin film on the faying surfaces. A schematic illustration of the process, shown in Figure 1, indicates that by placing a thin interlayer of an alloying metal containing a melting point depressant (MPD) between the two pieces of parent metal to be joined and heating the entire assembly, a liquid interlayer is formed. The liquid may form because the melting point of the interlayer has been exceeded, or because reaction with the parent metal results in a low melting liquid alloy. The liquid then fills voids formed by unevenness of the mating