Effects of stress ratio on fatigue crack propagation properties of submicron-thick free-standing copper films
Effects of stress ratio on fatigue crack propagation properties of submicron-thick free-standing copper films
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DOI:
10.1016/j.actamat.2013.07.017
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发表时间:
2013-09
期刊:
影响因子:
9.4
通讯作者:
T. Kondo;Takahiro Imaoka;H. Hirakata;Masayuki Sakihara;K. Minoshima
中科院分区:
文献类型:
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作者:
T. Kondo;Takahiro Imaoka;H. Hirakata;Masayuki Sakihara;K. Minoshima
The dominant mechanics and mechanisms of fatigue crack propagation in ca. 500 nm thick free-standing copper films were evaluated at the submicron level using fatigue crack propagation experiments at three stress ratios,R= 0.1, 0.5 and 0.8. Fatigue cracking initiated at the notch root and propagated stably under cyclic loading. The fatigue crack propagation rate (da/dN) vs. stress intensity factor range (ΔK) relation was dependent on the stress ratioR;da/dN, increases with increasingR. Plots of da/dNvs. the maximum stress intensity factor (Kmax) exhibited coincident features in the high-Kmaxregion (Kmax⩾ 4.5 MPa m1/2) irrespective ofR, indicating thatKmaxis the dominant factor in fatigue crack propagation. In this region, the fatigue crack propagated in tensile fracture mode irrespective of theRvalue. The region ahead of the fatigue crack tip is plastically stretched by tensile deformation, causing necking deformation in the thickness direction and consequent chisel-point fracture. In contrast, in the low-Kmaxregion (Kmax< 4.5 MPa m1/2), the da/dNvs.Kmaxfunction assumes higher values with decreasingR; in this region, the fracture mechanism depends onR. At the higherRvalue (R= 0.8), the fatigue crack propagates in the tensile fracture mode similar to that in the high-Kmaxregion. On the other hand, at the lowerRvalues (R= 0.1 and 0.5), a characteristic mechanism of fatigue crack propagation appears: within several grains, intrusions/extrusions form ahead of the crack tip along the Σ3 twin boundaries, and the fatigue crack propagates preferentially through the intrusions/extrusions.