A mild etch for the fabrication of three-dimensional nanostructures in gold
A mild etch for the fabrication of three-dimensional nanostructures in gold
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DOI：
10.1021/ja0555771
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发表时间：
2006-01-18
影响因子：
15
通讯作者：
Leggett, GJ
中科院分区：
文献类型：
--
作者：
Ducker, RE;Leggett, GJ
据报道，当与烷基硫醇抗蚀剂结合使用时，一种新颖的温和蚀刻可在金膜中制造三维结构。该蚀刻由巯基乙胺的乙醇溶液组成，其中添加了少量氢氧化铵。使用基于掩模的光刻技术，已经创建了具有良好边缘清晰度的微米级特征。对于长链硫醇，受硫醇保护的区域在长时间暴露于蚀刻溶液时几乎没有被侵蚀的趋势。与扫描近场光刻相结合，新的蚀刻解决方案能够制造尺寸明显小于传统衍射极限的纳米级结构。
A novel mild etch is reported for the fabrication of three-dimensional structures in gold films when used in conjunction with an alkylthiol resist. This etch consists of a solution of mercaptoethylamine in ethanol to which a small amount of ammonium hydroxide has been added. Using mask-based photolithography, micron-scale features have been created that exhibit good edge definition. For long-chain thiols, there is little tendency for the regions protected by thiols to be eroded on extended exposure to the etch solution. In conjunction with scanning near-field photolithography, the new etch solution enables the fabrication of nanoscale structures with dimensions significantly smaller than the conventional diffraction limit.