Enhanced thermal conductivity in copolymerized polyimide.
Enhanced thermal conductivity in copolymerized polyimide.
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DOI：
10.1016/j.isci.2022.105451
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发表时间：
2022-11-18
期刊：
影响因子：
5.8
通讯作者：
Xu, Xiangfan
中科院分区：
文献类型：
--
作者：
Liu, Bohai;Zhou, Yu;Dong, Lan;Lu, Qinghua;Xu, Xiangfan
从柔性电子产品和多功能纺织品到人造组织，聚合物几乎渗透到现代技术的各个方面。在其应用中通常需要聚合物具有高导热性，其中散热对于维持产品的可靠性和功能至关重要。然而，本体聚合物的固有导热性在很大程度上受到随机卷曲和缠结链构象的阻碍。在这里，我们报告了一种共聚策略，可以同时控制链内和链间跳跃，并在低水平引入2,4,5,7-四氨基-1,8-二羟基蒽-9,10-二酮（10%）时将线性共聚聚酰亚胺（PI）的导热率提高到纯PI的三倍。此外，大尺寸共聚PI薄膜在退火后表现出热稳定性。这些显着的结果使得块状 PI 成为热管理的潜在候选者，并且这种共聚方法可能有利于未来界面热材料的合成。一种制备大尺寸且热稳定的 PI 薄膜的共聚方法 可以同时增强共聚物中的链内和链间跳跃 共聚 PI 薄膜的热导率比纯 PI 聚合物化学高约 3 倍；热性能；聚合物
From flexible electronics and multifunctional textiles to artificial tissues, polymers penetrate nearly every aspect of modern technology. High thermal conductivity of polymers is often required in their applications, where heat dissipation is crucial to maintain product reliability and functionality. However, the intrinsic thermal conductivity of bulk polymers is largely hindered by the randomly coiled and entangled chain conformation. Here, we report a copolymerization strategy that can simultaneously manipulate the intrachain and interchain hopping and increase the thermal conductivity of linear copolymerized polyimide (PI) to three times higher than that of pure PI at a low-level introduction of 2,4,5,7-tetraamino-1,8-dihydroxyanthracene-9,10-dione (10%). In addition, the large-scale copolymerized PI films display thermal stability after annealing. These remarkable results allow bulk PI to be a potential candidate for thermal management, and this copolymerization method may benefit future synthesis of interfacial thermal materials. A copolymerization method to fabricate large-sized and thermally stable PI films The intrachain and interchain hopping in the copolymer can be simultaneously enhanced Thermal conductivity of copolymerized PI films is about 3x higher than that in pure PI Polymer chemistry; Thermal property; Polymers
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