Removable foams based on an epoxy resin incorporating reversible Diels-Alder adducts
Removable foams based on an epoxy resin incorporating reversible Diels-Alder adducts
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DOI：
10.1002/app.10753
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发表时间：
2002-08-15
影响因子：
3
通讯作者：
Aubert, JH
中科院分区：
文献类型：
--
作者：
Mcelhanon, JR;Russick, EM;Aubert, JH
我们已经成功地将Diels-Alder可逆化学结合到环氧树脂中。Diels-Alder化学在60°c时是正向的，在90°c或以上时是反向的。一种树脂与其他商业成分配制成泡沫环氧树脂。这种泡沫具有与传统环氧树脂形成的泡沫相似的机械性能，正被用于电子封装。由于内置的可逆化学反应，泡沫可以很容易地在90度的1-丁醇中溶解。拆卸允许对电子元件进行返工、升级或拆卸。(C) 2002 Wiley期刊有限公司
We have successfully incorporated Diels-Alder reversible chemistry into epoxy resins. The Diels-Alder chemistry goes in the forward direction at 60 degreesC and reverses at or above 90 degreesC. One resin was formulated with other commercial ingredients into foamed epoxy. The foam, shown to have mechanical properties similar to foams formed with conventional epoxy resins, is being utilized for electronic encapsulation. Because of the built-in reversible chemistry, the foams can be easily removed by dissolution in 1-butanol at 90 degreesC. Removal allows for the rework, upgrading, or dismantlement of the electronic components. (C) 2002 Wiley Periodicals, Inc.