Surface Wave Phenomenon in Wafer Probing Environments

Surface Wave Phenomenon in Wafer Probing Environments
复制标题

晶圆探测环境中的表面波现象

DOI:
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发表时间:
1992
期刊:
40th ARFTG Conference Digest
影响因子:
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通讯作者:
E. Godshalk
E. Godshalk
中科院分区:
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文献类型:
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作者:
E. Godshalk

文献摘要

被引文献

相似文献

研究了微波和毫米波在介质板中以及沿着介质板上的共面传输线的传播,揭示了可以用表面波现象解释的效应。这些表面波可以用晶片探针发射和接收,并影响共面传输线的传输特性。本文介绍了测量数据显示表面波的存在,以及它们如何与晶圆探针和共面波导传输线相互作用。探索和量化减少这些相互作用的方法。讨论了表面波对晶片校准的影响。
Investigation of microwave and millimeter wave propagation in dielectric slabs and along coplanar transmission lines on dielectric slabs, reveal effects that may be explained by surface wave phenomenon. These surface waves can be transmitted and received with wafer probes and influence the transmission characteristics of coplanar transmission lines. This paper presents measured data showing the presence of surface waves and how they interact with wafer probes and coplanar waveguide transmission lines. Methods for minimizing these interactions are explored and quantified. A discussion of surface wave effects on wafer calibrations is included.