Principles of Laser Materials Processing
Principles of Laser Materials Processing
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DOI：
10.1002/9780470459300
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发表时间：
2009-04
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影响因子：
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通讯作者：
E. Kannatey-Asibu
中科院分区：
文献类型：
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作者：
E. Kannatey-Asibu
第一节：工业激光器的原理。第1章：激光的产生。1.1基本原子结构。1.2原子跃迁。1.3生命周期。1.4光吸收。1.5人口倒置。1.6阈值增益。1.7双光子吸收。1.8摘要。问题。第二章：光学谐振器。2.1矩形空腔中的驻波。2.2平面谐振器。2.3共焦谐振器。2.4广义球面谐振器。2.5同心谐振器。2.6光学谐振器的稳定性。2.7摘要。问题。第三章：激光泵浦。3.1光泵浦。3.2电泵。3.3总结。问题。第四章：速率方程。4.1两级制。4.2三级系统。4.3四级制。4.4总结。问题。第五章：拓宽机制。5.1线形函数。5.2线条加宽机制。5.3个别机制的比较。5.4摘要。问题。第六章：梁的修改。6.1品质因数。6.2调Q。6.3调Q理论。6.4模式锁定。6.5激光尖峰。6.6羊肉蘸。6.7摘要。问题。第七章：波束特性。7.1光束发散。7.2单色性。7.3光束相干性。7.4强度和亮度。7.5频率稳定度。7.6光束大小。7.7聚焦。7.8辐射压力。7.9摘要。问题。第八章：激光的类型。8.1固态激光器。8.2气体激光器。8.3染料激光。8.4半导体(二极管)激光器。8.5自由电子激光器。8.6工业激光技术的新发展。8.7摘要。问题。第9章：光束传输。9.1电磁频谱。9.2反射和折射。9.3双折射。9.4布鲁斯特角。9.5极化。9.6镜片和镜片。9.7扩束器。9.8分束器。9.9光束传输系统。9.10摘要。问题。第二部分：工程背景。第十章：激光加工过程中的热和流体流动。10.1加工过程中的能量平衡。10.2工件内的热流。10.3熔池中的流体流动。10.4摘要。问题。第十一章：微观结构。11.1工艺微结构。11.2不连续。11.3摘要。问题。第十二章：固化。12.1无流动凝固。12.2流动固化。12.3快速凝固。12.4摘要。问题。第13章：残余应力和变形。13.1残余应力的原因。13.2基本应力分析。13.3残余应力的影响。13.4残余应力的测量。13.5消除残余应力和变形。13.6摘要。问题。第三节：激光材料加工。第14章：激光加工的背景知识。14.1系统相关参数。14.2流程效率。14.3影响过程质量的干扰。14.4激光加工的一般优点和缺点。14.5摘要。问题。第15章：激光切割和打孔。15.1激光切割。15.2激光打孔。15.3新发展。15.4摘要。问题。第16章：激光焊接。16.1激光焊接参数。16.2焊接效率。16.3激光焊接机理。16.4实质性考虑。16.5焊接件不连续。16.6激光焊接的优缺点。16.7特殊技术。16.8具体应用。16.9摘要。问题。第17章：激光表面改性。17.1激光表面热处理。17.2激光表面熔化。17.3激光直接金属沉积。17.4激光物理气相沉积。17.5激光冲击喷丸。17.6摘要。问题。第十八章：激光成形。18.1激光成形原理。18.2工艺参数。18.3激光成形机理。18.4流程分析。18.5优势和劣势。18.6项申请。18.7摘要。问题。第十九章：快速成型。19.1计算机辅助设计。19.2部分建筑。19.3后处理。19.4份申请。19.5摘要。问题。第20章：激光在医疗和纳米制造中的应用。20.1医疗应用。20.2纳米技术应用。20.3摘要。第21章：用于过程监控的传感器。21.1激光光束监测。21.2过程监控。21.3摘要。问题。第22章：传感器输出的处理。22.1信号变换。22.2数据精简。22.3模式分类。22.4摘要。问题。第23章：激光安全。23.1激光危害。23.2激光分类。23.3防止激光事故。23.4摘要。
SECTION I: PRINCIPLES OF INDUSTRIAL LASERS. Chapter 1: Laser Generation. 1.1 Basic Atomic Structure. 1.2 Atomic Transitions. 1.3 Lifetime. 1.4 Optical Absorption. 1.5 Population Inversion. 1.6 Threshold Gain. 1.7 Two-Photon Absorption. 1.8 Summary. Problems. Chapter 2: Optical Resonators. 2.1 Standing Waves in a Rectangular Cavity. 2.2 Planar Resonators. 2.3 Confocal Resonators. 2.4 Generalized Spherical Resonators. 2.5 Concentric Resonators. 2.6 Stability of Optical Resonators. 2.7 Summary. Problems. Chapter 3: Laser Pumping. 3.1 Optical Pumping. 3.2 Electrical Pumping. 3.3 Summary. Problems. Chapter 4: Rate Equations. 4.1 Two-Level System. 4.2 Three-Level System. 4.3 Four-Level System. 4.4 Summary. Problems. Chapter 5: Broadening Mechanisms. 5.1 Line-Shape Function. 5.2 Line-Broadening Mechanisms. 5.3 Comparison of Individual Mechanisms. 5.4 Summary. Problems. Chapter 6: Beam Modification. 6.1 Quality Factor. 6.2 Q-Switching. 6.3 Q-Switching Theory. 6.4 Mode-Locking. 6.5 Laser Spiking. 6.6 Lamb Dip. 6.7 Summary. Problems. Chapter 7: Beam Characteristics. 7.1 Beam Divergence. 7.2 Monochromaticity. 7.3 Beam Coherence. 7.4 Intensity and Brightness. 7.5 Frequency Stabilization. 7.6 Beam Size. 7.7 Focusing. 7.8 Radiation Pressure. 7.9 Summary. Problems. Chapter 8: Types of Lasers. 8.1 Solid State Lasers. 8.2 Gas Lasers. 8.3 Dye Lasers. 8.4 Semiconductor (Diode) Lasers. 8.5 Free Electron Laser. 8.6 New Developments in Industrial Laser Technology. 8.7 Summary. Problems. Chapter 9: Beam Delivery. 9.1 The Electromagnetic Spectrum. 9.2 Reflection and Refraction. 9.3 Birefringence. 9.4 Brewster Angle. 9.5 Polarization. 9.6 Mirrors and Lenses. 9.7 Beam Expanders. 9.8 Beam Splitters. 9.9 Beam Delivery Systems. 9.10 Summary. Problems. SECTION II: ENGINEERING BACKGROUND. Chapter 10: Heat and Fluid Flow During Laser Processing. 10.1 Energy Balance During Processing. 10.2 Heat Flow in the Workpiece. 10.3 Fluid Flow in Molten Pool. 10.4 Summary. Problems. Chapter 11: The Microstructure. 11.1 Process Microstructure. 11.2 Discontinuities. 11.3 Summary. Problems. Chapter 12: Solidification. 12.1 Solidification Without Flow. 12.2 Solidification With Flow. 12.3 Rapid Solidification. 12.4 Summary. Problems. Chapter 13: Residual Stresses and Distortion. 13.1 Causes of Residual Stresses. 13.2 Basic Stress Analysis. 13.3 Effects of Residual Stresses. 13.4 Measurement of Residual Stresses. 13.5 Relief of Residual Stresses and Distortion. 13.6 Summary. Problems. SECTION III: LASER MATERIALS PROCESSING. Chapter 14: Background on Laser Processing. 14.1 System-Related Parameters. 14.2 Process Efficiency. 14.3 Disturbances that Affect Process Quality. 14.4 General Advantages and Disadvantages of Laser Processing. 14.5 Summary. Problems. Chapter 15: Laser Cutting and Drilling. 15.1 Laser Cutting. 15.2 Laser Drilling. 15.3 New Developments. 15.4 Summary. Problems. Chapter 16: Laser Welding. 16.1 Laser Welding Parameters. 16.2 Welding Efficiency. 16.3 Mechanism of Laser Welding. 16.4 Material Considerations. 16.5 Weldment Discontinuities. 16.6 Advantages and Disadvantages of Laser Welding. 16.7 Special Techniques. 16.8 Specific Applications. 16.9 Summary. Problems. Chapter 17: Laser Surface Modification. 17.1 Laser Surface Heat Treatment. 17.2 Laser Surface Melting. 17.3 Laser Direct Metal Deposition. 17.4 Laser Physical Vapor Deposition. 17.5 Laser Shock Peening. 17.6 Summary. Problems. Chapter 18: Laser Forming. 18.1 Principle of Laser Forming. 18.2 Process Parameters. 18.3 Laser Forming Mechanisms. 18.4 Process Analysis. 18.5 Advantages and Disadvantages. 18.6 Applications. 18.7 Summary. Problems. Chapter 19: Rapid Prototyping. 19.1 Computer-Aided Design. 19.2 Part Building. 19.3 Post-Processing. 19.4 Applications. 19.5 Summary. Problems. Chapter 20: Lasers in Medical and Nano Manufacturing. 20.1 Medical Applications. 20.2 Nanotechnology Applications. 20.3 Summary. Chapter 21: Sensors for Process Monitoring. 21.1 Laser Beam Monitoring. 21.2 Process Monitoring. 21.3 Summary. Problems. Chapter 22: Processing of Sensor Outputs. 22.1 Signal Transformation. 22.2 Data Reduction. 22.3 Pattern Classification. 22.4 Summary. Problems. Chapter 23: Laser Safety. 23.1 Laser Hazards. 23.2 Laser Classification. 23.3 Preventing Laser Accidents. 23.4 Summary.