ゲル電解質を用いた銅めっき II. 電気化学インピーダンス法による銅電析反応の解析
ゲル電解質を用いた銅めっき II. 電気化学インピーダンス法による銅電析反応の解析
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凝胶电解液镀铜II．电化学阻抗法分析铜电沉积反应
DOI：
10.4139/sfj.54.293
复制
发表时间：
2003
期刊：
影响因子：
--
通讯作者：
和哉 安田
中科院分区：
文献类型：
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作者：
昌幸 板垣;賢一 下田;邦洋 渡辺;和哉 安田
用电化学阻抗谱（EIS）研究了凝胶电解液中铜的电沉积。电化学阻抗测量在凝胶电解质含有各种氯化物浓度。在低频下的电化学阻抗的奈奎斯特图上描述了一个电感环和第二电容环。这些被称为法拉第阻抗，其源自电极反应的基本步骤。瓦尔堡阻抗在低频率下观察到的扩散限制电流区，表明从溶液本体到电极表面的Cu（II）扩散的贡献。在此基础上提出了铜在凝胶电解液中的电沉积模型。通过数值模拟，验证了所提出的电沉积模型，并获得了动力学参数。此外，氯离子的影响进行了讨论，从所获得的动力学参数。
Copper electrodeposition in a gel electrolyte has been studied by an electrochemical impedance spectroscopy (EIS). The electrochemical impedance was measured in a gel electrolyte containing various chloride concentrations. An inductive loop and a second capacitive loop were described on the Nyquist plot of electrochemical impedance at low frequency. These are called Faradaic impedance, which originates from the elementary steps of an electrode reaction. Warburg impedance was observed at low frequency in the diffusion limiting current region, indicating the contribution of the Cu(II) diffusion from the solution bulk to the electrode surface. The electrodeposition model of copper in the gel electrolyte was proposed on the basis of above-mentioned results. The numerical simulations were performed to confirm the proposed electrodeposition model and to obtain the kinetic parameters. Moreover, the influence of chloride was discussed from the obtained kinetic parameters.
木质素基凝胶电解质的制备
DOI：
--
发表时间：
2020
期刊：
影响因子：
--
作者：
○平良尚梧;本多史弥;重冨顕吾，浦木康光
通讯作者：
重冨顕吾，浦木康光