Cotunneling of holes in silicon-based structures.

Cotunneling of holes in silicon-based structures.
复制标题

硅基结构中的孔洞掘进。

DOI:
10.1103/physrevb.49.16514
复制
发表时间:
1994
期刊:
Physical review. B, Condensed matter
影响因子:
--
通讯作者:
Whall
Whall
中科院分区:
--
文献类型:
--
作者:
Paul;Cleaver;Ahmed;Whall

文献摘要

被引文献

相似文献

在低于库仑阻塞阈值的偏压下,研究了δ掺杂硅锗双隧道结系统中空穴的非弹性共隧穿.非弹性,线性,有限温度cotunneling长期占主导地位的较低的电压,而零温度,立方cotunneling长期占主导地位的温度高于4.2 K的库仑阻塞阈值以下的较高电压。
Inelastic cotunneling of holes through double-tunnel-junction systems fabricated in δ-doped silicon-germanium layers was studied for bias voltages below the Coulomb blockade threshold. The inelastic, linear, finite-temperature cotunneling term dominates for lower voltages while the zero-temperature, cubic cotunneling term dominates for higher voltages below the Coulomb blockade threshold for temperatures above 4.2 K.