Fabrication of nano-pillar chips by a plasma etching technique for fast DNA separation
Fabrication of nano-pillar chips by a plasma etching technique for fast DNA separation
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DOI：
10.1016/j.tsf.2006.10.072
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发表时间：
2007-04-23
期刊：
影响因子：
2.1
通讯作者：
Horiike, Y.
中科院分区：
文献类型：
--
作者：
Ogawa, R.;Ogawa, H.;Horiike, Y.
研究了用镍掩模干法刻蚀制备石英纳米柱的方法。在刻蚀过程中，由于铂/铬种子层的再次溅射，掩模直径增大。然而，一旦种子层被侵蚀，扩大的掩膜直径不会进一步增加。因此，掩模的使用使得能够制造出具有高纵横比的纳米柱。高频石英板压力键合的原位FTIR-ATR观察发展了一种新的键合技术，涉及到H_2SiF_6的使用。然后，纳米柱芯片可以在20分钟内将10kBP和38kBP的DNA进行大小分离。(C)2006年爱思唯尔公司版权所有。
The fabrication of quartz nano-pillars was investigated using dry etching with a Ni mask. The mask diameter increased during etching due to re-sputtering of the Pt/Cr seed layer. However, once the seed layer had been eroded the enlarged mask diameter did not increase any further. Hence, the use of the mask enabled the fabrication of nano-pillars with a high aspect ratio. In situ FTIR-ATR observation of HF quartz plate pressure bonding developed a new bonding technique involving the use of H2SiF6. The nano-pillar chips allowed then to size-separate DNA of 10 kbp and 38 kbp within 20 s. (c) 2006 Elsevier B.V. All rights reserved.