Extreme Two-Phase Cooling from Laser-Etched Diamond and Conformal, Template-Fabricated Microporous Copper
Extreme Two-Phase Cooling from Laser-Etched Diamond and Conformal, Template-Fabricated Microporous Copper
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DOI：
10.1002/adfm.201703265
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发表时间：
2017-12-01
影响因子：
19
通讯作者：
Goodson, Kenneth E.
中科院分区：
文献类型：
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作者：
Palko, James W.;Lee, Hyoungsoon;Goodson, Kenneth E.
本文报道了首次将激光刻蚀多晶金刚石微通道与模板制备的微孔铜集成在一个用于电力电子和能量转换的复合热沉中进行极端对流沸腾。钻石在室温附近提供最高的导热系数，并以1：1的纵横比沿三角形通道壁热扩散。具有25微米厚度和5微米孔径的共形涂层多孔铜优化了钻石通道内对流沸腾的流体和热传输。这里报告的数据包括从0.7 cm(2)表面积上移出1280W cm(-2)的热量，超过流体饱和度的温升小于21K，相当于6.3×10(5)Wm(-2)K-1。这种散热器有可能以较小的温度不均匀性(200微米x 200微米)驱散更大的局部热负荷
This paper reports the first integration of laser-etched polycrystalline diamond microchannels with template-fabricated microporous copper for extreme convective boiling in a composite heat sink for power electronics and energy conversion. Diamond offers the highest thermal conductivity near room temperature, and enables aggressive heat spreading along triangular channel walls with 1:1 aspect ratio. Conformally coated porous copper with thickness 25 mu m and 5 mu m pore size optimizes fluid and heat transport for convective boiling within the diamond channels. Data reported here include 1280 W cm(-2) of heat removal from 0.7 cm(2) surface area with temperature rise beyond fluid saturation less than 21 K, corresponding to 6.3 x 10(5) W m(-2) K-1. This heat sink has the potential to dissipate much larger localized heat loads with small temperature nonuniformity (5 kW cm(-2) over 200 mu m x 200 mu m with