Fabrication of Insulation Coatings on Additively Manufactured CuCrZr Electrical Windings

Fabrication of Insulation Coatings on Additively Manufactured CuCrZr Electrical Windings
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增材制造 CuCrZr 电气绕组绝缘涂层的制造

DOI:
10.1109/tdei.2023.3324285
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发表时间:
2024
影响因子:
3.1
通讯作者:
Munagala S
Munagala S
中科院分区:
工程技术3区
文献类型:
--
作者:
Munagala S

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为了降低电机中的交流损耗,增材制造(AM)已被采用以利用绕组设计中的几何自由度。然而,AM带来了新的挑战,如表面粗糙度和孔隙度,这可能会给绕组的后处理(如施加绝缘涂层)带来困难。本文研究了AM处理的CuCrZr的表面粗糙度(轮廓)的影响,作为一个潜在的候选人的电气绕组的几何形状,表面粗糙度,孔隙度,和氧化对它们的绝缘。比较了粉末、喷涂和浸涂三种工艺的绝缘性能和可行性。整个过程通过计算机断层扫描、表面轮廓测量、光学显微镜、X射线光子光谱和涂层过程不同阶段的击穿电压(BV)等技术进行量化。该研究还包括商业矩形铜线上的涂层作为参考。涂层的初步评估得出结论,表面粗糙度和涂层工艺都是绝缘AM组件成功的重要决定因素。基本的表面平滑是需要摆脱布尔斯和喷涂技术是最好的,因为它的能力,以产生保形涂层。
To lower the ac losses in electrical machines, additive manufacturing (AM) has been adopted to exploit the geometrical freedom in winding design. However, AM brings about new challenges such as surface roughness and porosity which can create difficulties for post processing of the windings such as applying insulation coatings. The article investigates the influence of surface roughness (profile) of AM-processed CuCrZr as a potential candidate for electrical windings in terms of geometry, surface roughness, porosity, and oxidation on their insulation. The feasibility and characteristics of insulations applied via three processing techniques namely powder, spray, and dip coating are compared. The entire process is quantified via techniques such as computed tomography, surface profilometry, optical microscopy, X-ray photon spectroscopy, and breakdown voltage (BV) at different stages of the coating process. The study also includes coating on a commercial rectangular copper wire as a reference. The initial assessment of coatings concludes that surface roughness and the coating process are both vital determinants for the success of insulating AM components. Basic surface smoothening is needed to get rid of burs and the spray coating technique was the best among others for its capability to produce conformal coating.
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DOI: 10.1109/tdei.2019.008380
发表时间: 2020
影响因子: 3.1
作者:
Y. Pang;S. Hodgson
通讯作者: S. Hodgson