Mechanism for stamp collapse in soft lithography
Mechanism for stamp collapse in soft lithography
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DOI：
10.1063/1.2149513
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发表时间：
2005-12
影响因子：
4
通讯作者：
W. Zhou;Yonggang Huang;E. Menard;N. Aluru;J. Rogers;A. Alleyne
中科院分区：
文献类型：
--
作者：
W. Zhou;Yonggang Huang;E. Menard;N. Aluru;J. Rogers;A. Alleyne
软光刻弹性体单元浮雕凹陷特征的机械塌陷是软光刻技术的一个重要现象。通过比较计算和测量的部分坍塌结构的形状，我们发现，对于典型的材料和加工条件，坍塌的主要机制是弹性体和衬底之间的表面粘附。特别是，使用考虑表面粘附的模型得到的形状与实验测量的形状吻合得很好。静电力可能有助于这一过程，但它们不占主导地位。弹性体的重量基本上没有影响。
Mechanical collapse of recessed features of relief on elastomeric elements for soft lithography represents an important phenomena for this lithographic technology. By comparing computed and measured shapes of partially collapsed structures, we show that the dominant mechanism for collapse is surface adhesion between the elastomer and substrate, for typical materials and processing conditions. In particular, the shapes obtained using models that account for surface adhesion agree well with the experimentally measured shapes. Electrostatic forces may contribute to this process, but they do not dominate. The weight of the elastomer has essentially no effect.