Passively assembled optical interconnection system based on an optical printed-circuit board
Passively assembled optical interconnection system based on an optical printed-circuit board
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基于光印刷电路板的无源组装光互连系统
DOI：
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发表时间：
2006
期刊：
影响因子：
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通讯作者：
Sang
中科院分区：
文献类型：
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作者：
S. Hwang;M. Cho;Sae;Hyo;H. Cho;Sang Hoon Kim;K. Shin;Sang
我们提出了一个被动组装的芯片到芯片的光互连系统，使用光纤技术。为了演示该系统，准备了三个组件：光纤嵌入式光学印刷电路板（OPCB）、光学发射器/接收器模块和90/spl度/弯曲光纤连接器。所有组件都使用精确的导销和孔进行组装，以便在OPCB中实现完全被动对准。已成功地从组装的系统中演示了总链路损耗为-1.5dB的5-Gb/s/ch信号的光链路。
We propose a passively assembled chip-to-chip optical interconnection system using fiber-optic technology. To demonstrate the system, three components were prepared: a fiber-embedded optical printed-circuit board (OPCB), optical transmitter/receiver modules, and 90/spl deg/-bent fiber connectors. All components were assembled using precise guide pins and holes so that complete passive alignment was achieved in the OPCB. An optical link of 5-Gb/s/ch signals with a total link loss of -1.5 dB has been successfully demonstrated from the assembled system.