Coax via-A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling
Coax via-A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling
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通过 FDTD 和 MoM 建模验证的同轴过孔 A 技术可减少高频多层封装中过孔处的串扰并增强阻抗匹配
DOI：
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发表时间：
1997
期刊：
影响因子：
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通讯作者：
E. Pillai
中科院分区：
文献类型：
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作者：
E. Pillai
通孔处的大规模串扰和差的通孔电性能是现有技术的高频多层第一或第二级集成电路/单片微波集成电路（IC/MMIC）封装中的主要缺点。本文中建模的同轴过孔设计在实现超过30 dB的超宽带串扰降低和提供增强的阻抗匹配方面开辟了新的天地。
Large-scale crosstalk at vias and poor via electrical performance are major drawbacks in state-of-the-art high-frequency multilayer first- or second-level integrated-circuit/monolithic-microwave integrated-circuit (IC/MMIC) packages. The coax via design modeled in this paper breaks new ground in achieving more than 30-dB ultrawide-band crosstalk reduction and providing an enhanced impedance match.