In Situ Direct Laser Writing of 3D Graphene‐Laden Microstructures
In Situ Direct Laser Writing of 3D Graphene‐Laden Microstructures
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DOI：
10.1002/admt.202100222
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发表时间：
2021-06
影响因子：
6.8
通讯作者：
Michael A. Restaino;Noah Eckman;Abdullah T. Alsharhan;Andrew C. Lamont;Jackson D. Anderson;D. Weinstein;A. Hall;R. Sochol
中科院分区：
文献类型：
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作者：
Michael A. Restaino;Noah Eckman;Abdullah T. Alsharhan;Andrew C. Lamont;Jackson D. Anderson;D. Weinstein;A. Hall;R. Sochol
广泛的应用依赖于将导电微结构与微流体通道集成的能力。为了绕过传统微制造工艺的平面几何限制，研究人员最近探索了使用“直接激光写入（DLW）”-一种亚微米级增材制造（或“3D打印”）技术-用于创建具有完全3D配置的导电微特征。尽管在DLW兼容的光材料的开发方面取得了相当大的进展，但支持导电性的热后处理要求仍然是微流体集成的关键障碍。在这项工作中，研究了新型石墨烯负载的光复合材料，以使真正的3D导电微结构直接在封闭的微通道内（即，原位）。包含高达10重量%的还原氧化石墨烯（rGO）颗粒浓度的光反应性复合材料表现出与DLW的高相容性，在临界波长处具有最小的光学干扰。所开发的rGO-光复合材料的最终直流电导率为9.85 ± 0.48 × 10−5 S m−1。3D微弹簧圈（1 wt% rGO;线直径= 10 µm;弹簧圈直径= 40 µm）的DLW实验结果显示，在2 MHz下的阻抗为2.71 ± 0.12 MΩ。此外，几何复杂的rGO负载微结构的原位DLW的结果表明所提出的方法对于潜在的基于3D微电子的微流体应用的实用性。
A wide range of applications rely on the ability to integrate electrically conductive microstructures with microfluidic channels. To bypass the planar geometric restrictions of conventional microfabrication processes, researchers have recently explored the use of “Direct Laser Writing (DLW)”—a submicron‐scale additive manufacturing (or “3D printing”) technology—for creating conductive microfeatures with fully 3D configurations. Despite considerable progress in the development of DLW‐compatible photomaterials, thermal post‐processing requirements to support electrical conductivity remain a critical barrier to microfluidics integration. In this work, novel graphene‐laden photocomposites are investigated to enable DLW‐based printing of true 3D conductive microstructures directly inside of enclosed microchannels (i.e., in situ). Photoreactive composite materials comprising reduced graphene oxide (rGO) particle concentrations of up to 10 wt% exhibited high compatibility with DLW, with minimal optical interference at critical wavelengths. Developed rGO‐photocomposites revealed an ultimate DC conductivity of 9.85 ± 0.48 × 10−5 S m−1. Experimental results for DLW of 3D microcoils (1 wt% rGO; wire diameter = 10 µm; coil diameter = 40 µm) revealed an impedance of 2.71 ± 0.12 MΩ at 2 MHz. In addition, results for in situ DLW of geometrically sophisticated rGO‐laden microstructures suggest utility of the presented approach for potential 3D microelectronics‐based microfluidic applications.