Molecular dynamics simulation model for the quantitative assessment of tool wear during single point diamond turning of cubic silicon carbide

Molecular dynamics simulation model for the quantitative assessment of tool wear during single point diamond turning of cubic silicon carbide
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DOI:
10.1016/j.commatsci.2011.07.052
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发表时间:
2012-01-01
影响因子:
3.3
通讯作者:
Reuben, Robert L.
Reuben, Robert L.
中科院分区:
材料科学3区
文献类型:
--
作者:
Goel, Saurav;Luo, Xichun;Reuben, Robert L.

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碳化硅(SiC)是一种非常有技术价值的材料,用于工程应用,涉及硅基组件无法工作的恶劣环境(超过623 K)。单点金刚石车削(SPDT)仍然是利用这种较硬材料的加工效率和自由形状的优越和可行的方法。然而,由于突然和快速的刀具磨损,在延展性状态下持续加工这种陶瓷是非常困难的。因此,在SiC的SPDT过程中,准确了解刀具磨损机制,以确定抑制磨损的措施,以最大限度地降低操作成本,这变得非常重要。本文采用基于势能函数的分子动力学(MD)模拟方法,采用现实分析键序势(ABOP)形式来理解SiC单点金刚石车削过程中的刀具磨损机理。利用径向分布函数得到了最显著的结果,表明金刚石刀具在加工过程中发生了石墨化。这种现象的发生是由于这两种超硬材料之间的磨蚀过程。磨蚀作用导致局部高温与巨大的切削力相结合,导致金刚石刀具sp(3)-sp(2)有序-无序转变。这是立方碳化硅SPDT加工过程中刀具磨损的根本原因。进一步的测试开发了一种新的方法,可以通过MD模拟来定量评估金刚石工具磨损的进展。爱思唯尔B.V.版权所有
Silicon carbide (SiC) is a material of great technological interest for engineering applications concerning hostile environments where silicon-based components cannot work (beyond 623 K). Single point diamond turning (SPDT) has remained a superior and viable method to harness process efficiency and freeform shapes on this harder material. However, it is extremely difficult to machine this ceramic consistently in the ductile regime due to sudden and rapid tool wear. It thus becomes non trivial to develop an accurate understanding of tool wear mechanism during SPDT of SiC in order to identify measures to suppress wear to minimize operational cost.In this paper, molecular dynamics (MD) simulation has been deployed with a realistic analytical bond order potential (ABOP) formalism based potential energy function to understand tool wear mechanism during single point diamond turning of SiC. The most significant result was obtained using the radial distribution function which suggests graphitization of diamond tool during the machining process. This phenomenon occurs due to the abrasive processes between these two ultra hard materials. The abrasive action results in locally high temperature which compounds with the massive cutting forces leading to sp(3)-sp(2) order-disorder transition of diamond tool. This represents the root cause of tool wear during SPDT operation of cubic SiC. Further testing led to the development of a novel method for quantitative assessment of the progression of diamond tool wear from MD simulations. Crown Copyright (C) 2011 Published by Elsevier B.V. All rights reserved.