Mechanical Bonding of Aluminum Hybrid Alloy Systems through High‐Pressure Torsion

Mechanical Bonding of Aluminum Hybrid Alloy Systems through High‐Pressure Torsion
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DOI:
10.1002/adem.201900483
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发表时间:
2019-08
影响因子:
3.6
通讯作者:
M. Kawasaki;Seon-Ho Jung;Jeong-Min Park;Jongsup Lee;J. Jang;Jae-Kyung Han
M. Kawasaki;Seon-Ho Jung;Jeong-Min Park;Jongsup Lee;J. Jang;Jae-Kyung Han
中科院分区:
材料科学3区
文献类型:
--
作者:
M. Kawasaki;Seon-Ho Jung;Jeong-Min Park;Jongsup Lee;J. Jang;Jae-Kyung Han

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本研究展示了一种创新的方法,即在显微组织细化过程中利用高压扭转(HPT)处理对异种金属进行机械结合。这种加工方法最近已经开发出来,用于引入具有改进的物理和机械性能的独特合金系统。因此,本研究特别关注在机械结合的Al-Mg和Al-Cu混合合金系统中,当通过HPT处理在室温下在6.0 GPa下以高达60的非常高的匝数合成时,微观结构演变和微观机械响应的发展。显微组织和硬度评价证实了HPT程序形成异质结构的能力,在这些处理的合金系统中,在盘外围具有极高的硬度,在盘中心具有低的硬度。纳米压痕测量表明,这两种混合合金系统表现出优异的塑性在磁盘边缘,硬度是最高的。通过HPT工艺将固态反应应用于异种金属的结合作为制造技术和混合合金系统的开发具有相当大的潜力。
The present study demonstrates an innovative approach of utilizing high‐pressure torsion (HPT) processing for the mechanical bonding of dissimilar metals during the microstructural refinement process. This processing approach has been developed recently for introducing unique alloy systems with improving physical and mechanical properties. Accordingly, the present study focuses specifically on the microstructural evolution and development in micro‐mechanical responses in the mechanically bonded Al‐Mg and Al‐Cu hybrid alloy systems when synthesized by HPT processing for very high number of turns up to 60 under 6.0 GPa at room temperature. The microstructural and hardness evaluations confirm the capability of the HPT procedure for the formation of heterostructures with extreme hardness at the disk peripheries and with low hardness at the disk centers in these processed alloy systems. Nanoindentation measurements demonstrate that both hybrid alloy systems exhibit excellent plasticity at the disk edges, where the hardness is the highest. There is a considerable potential for applying the solid‐state reaction through the HPT process for the bonding of dissimilar metals as a manufacturing technique and for the development of hybrid alloy systems.