The effect of the PyC interphase coating on the microwave heating sintered SiC/SiC composites
The effect of the PyC interphase coating on the microwave heating sintered SiC/SiC composites
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PyC界面涂层对微波加热烧结SiC/SiC复合材料的影响
DOI：
10.1016/j.jallcom.2016.07.288
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发表时间：
2016-12
影响因子：
6.2
通讯作者：
Huang Zelan
中科院分区：
文献类型：
--
作者：
Li Mingyuan;Zhou Xingui;Yang Huiyong;Yu Jinshan;Wang Honglei;Huang Zelan
采用聚合物浸渗热解（PIP）工艺，在1100 °C下，以3 MPa的热压压力辅助微波烧结，制备了不同厚度热解碳（PyC）界面涂层的SiC/SiC复合材料。通过压汞试验、CT和SEM研究了PyC涂层厚度对SiC/SiC复合材料致密化、弯曲性能和显微结构的影响。结果表明，在热压成型过程中，较薄的PyC涂层具有较好的柔韧性，因此，较薄的PyC涂层制备的SiC/SiC复合材料具有较高的致密化程度。同时，较厚的PyC涂层导致SiC纤维和基体之间的界面脱粘较弱，通过单纤维推出试验进行量化。过厚或过薄的PyC涂层均会导致SiC纤维与基体过早或过晚脱粘，从而不利于SiC纤维的弯曲性能。PyC涂层厚度约为0.20 μm，弯曲性能较好。
SiC/SiC composites coated with the pyrolytic carbon (PyC) interphase coatings of different thickness were fabricated by polymer infiltration and pyrolysis (PIP) process using microwave sintering at 1100 °C assisted with the hot mould pressing pressure of 3 MPa. The effects of the PyC coating thickness on the densification, the flexural properties and microstructures of the fabricated SiC/SiC composites were investigated via the mercury intrusion test, the computed tomography (CT) technique and scanning electron microscopy (SEM). The results indicate that the preforms coated with thinner PyC coatings, which have better flexibility under the hot mould pressing process, bring SiC/SiC composites with higher densification degrees, due to their better flexibility under the hot press moulding process. Simultaneously, thicker PyC coatings result in weaker interphase debonding between SiC fibers and matrix quantified by the single fiber push-out test. Too thick or too thin PyC coatings both make against the flexural properties, as they will cause the debonding between SiC fibers and matrix too early or too late. The PyC coating thickness-0.20 μm is approximate for the better flexural properties.
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DOI：
10.1016/0921-5093(96)10170-2
发表时间：
1996-06
影响因子：
6.4
作者：
K. Goto;Y. Kagawa
通讯作者：
K. Goto;Y. Kagawa
影响因子：
5.7
作者：
J. Kimmel;Narendernath Miriyala;J. Price;K. More;P. Tortorelli;H. Eaton;G. Linsey;E. Sun
通讯作者：
J. Kimmel;Narendernath Miriyala;J. Price;K. More;P. Tortorelli;H. Eaton;G. Linsey;E. Sun
DOI：
--
发表时间：
2008
期刊：
Journal of Physics D
影响因子：
--
作者：
F. ChadwickSJ;E. VirdenA;Haehnel;D. DutsonJ;K. Matsumoto;T. Yoshida;T. Sawano;T. Goto;
通讯作者：
F. ChadwickSJ;E. VirdenA;Haehnel;D. DutsonJ;K. Matsumoto;T. Yoshida;T. Sawano;T. Goto;
微波烧结时间对SiC/SiC复合材料弯曲性能的影响
影响因子：
5.2
作者：
Yang Huiyong;Zhou Xingui;Yu Jinshan;Wang Honglei;Huang Zelan
通讯作者：
Huang Zelan
影响因子：
4.6
作者：
Padmavathi, C.;Upadhyaya, A.;Agrawal, D.
通讯作者：
Agrawal, D.