Influence of Ag substrates on grain alignment and critical current density of Bi-2212 tape conductors
Influence of Ag substrates on grain alignment and critical current density of Bi-2212 tape conductors
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DOI：
10.1109/77.784806
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发表时间：
1999-06
影响因子：
1.8
通讯作者：
H. Kumakura;H. Kitaguchi;K. Togano;T. Muroga;Junichi Sato;M. Okada
中科院分区：
文献类型：
--
作者：
H. Kumakura;H. Kitaguchi;K. Togano;T. Muroga;Junichi Sato;M. Okada
We investigated the influence of Ag substrate on the microstructure and J/sub c/ values of dip-coated Bi-2212/Ag tapes. The grain alignment of Bi-2212 in the oxide/Ag interface was much higher than that in the free surface of oxide. J/sub c/ increases with increasing oxide/Ag interface area and with decreasing oxide layer thickness, while J/sub c/ was almost independent of the free surface area. The smoothness of the Ag substrate is also an important factor. Micrometer-size roughness of the Ag substrate results in a decrease of Bi-2212 grain alignment and therefore J/sub c/. Addition of alloying elements to the Ag also degrades the grain alignment of Bi-2212 and decreased J/sub c/. Cold rolling before the heat treatment improved the grain alignment and enhanced J/sub c/.
