Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator
Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator
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DOI：
10.1109/tcpmt.2016.2543001
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发表时间：
2016-04
期刊：
影响因子：
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通讯作者：
E. Arjmand;P. Agyakwa;M. Corfield;Jianfeng Li;C. Mark Johnson
中科院分区：
文献类型：
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作者：
E. Arjmand;P. Agyakwa;M. Corfield;Jianfeng Li;C. Mark Johnson
引线键合工艺的常规监控需要对引线键合质量进行实时评估和控制。在本文中，我们提出了一种无损检测技术，通过应用半监督分类算法处理从超声波发生器获得的信号来检测键合质量。实验测试验证了分类方法是能够准确地预测键合质量，由X射线断层扫描测量的键合面积表示。在粘结期间分类的样品经受-55 °C和+125 °C之间的温度循环，并且分析不同类别之间的粘结寿命分布。它表明，作为粘结质量分类是密切相关的热循环寿命，因此，可以被用作一种无损的工具，用于监测粘结质量和预测有用的使用寿命。
Routine monitoring of the wire bonding process requires real-time evaluation and control of wire bond quality. In this paper, we present a nondestructive technique for detecting bond quality by the application of a semisupervised classification algorithm to process the signals obtained from an ultrasonic generator. Experimental tests verified that the classification method is capable of accurately predicting bond quality, indicated by bonded area measured by X-ray tomography. Samples classified during bonding were subjected to temperature cycling between -55 °C and +125 °C, and the distribution of bond life amongst the different classes was analyzed. It is demonstrated that the as-bonded quality classification is closely correlated with thermal cycling life and can, therefore, be used as a nondestructive tool for monitoring bond quality and predicting useful service life.