Effect of various Ni plating layers and aging on microstructure and shear strength of Sn–2.5Ag–2.0Ni solder joint
Effect of various Ni plating layers and aging on microstructure and shear strength of Sn–2.5Ag–2.0Ni solder joint
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DOI：
10.1016/j.surfcoat.2009.03.014
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发表时间：
2009-07
影响因子：
5.4
通讯作者：
Mao Wu;Xin-Bo He;Rafi-ud-din;S. Ren;Mingli Qin;X. Qu
中科院分区：
文献类型：
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作者：
Mao Wu;Xin-Bo He;Rafi-ud-din;S. Ren;Mingli Qin;X. Qu
采用Sn-2.5Ag-2.0Ni合金对SiC增强铝基复合材料（SiCp/Al）基体进行了钎焊。通过实验研究了不同镍镀层对焊点组织和可靠性的影响。三层无电镀Ni层，包括Ni-5重量% P、Ni-10重量% P和Ni-B合金。化学镀Ni-B层与钎料具有良好的润湿性，在时效过程中Ni3Sn4IMC的生长速率最低。通过使用低P含量Ni-5wt. %，抑制了显著影响焊点可靠性的Ni2SnP的形成P层。化学镀Ni-B镀层的焊点剪切强度最高，当Ni-5wt. %与Ni-10重量%相比，P层产生更高的剪切强度。P层。Ni-5wt. %的焊点失效的主要原因是Ni_3Sn_4IMC的长大和裂纹的形成P，而Ni-10 wt. % P焊点经长期时效后形成Ni2SnP、富P Ni层和Kirkendall空洞。
Sn–2.5Ag–2.0Ni alloy is used to solder silicon carbide reinforced aluminum matrix (SiCp/Al) composites substrate with various Ni coatings. An experimental study is carried out to assess the effects of various Ni coatings on the microstructure and reliability of solder joint. Three electroless Ni layers, including Ni–5 wt.%P, Ni–10 wt.%P and Ni–B, are investigated. The electroless Ni–B layer is found to have good wettability with solder and gives the lowest growth rate of Ni3Sn4IMCs during aging. The formation of Ni2SnP, which significantly affects the reliability of solder joints, is suppressed by using the low P content Ni–5 wt.%P layer. The electroless Ni–B layer has given the highest shear strength of solder joint while Ni–5 wt.%P layer yields the higher shear strength as compared to Ni–10 wt.%P layer. Growth of Ni3Sn4IMCs and formation of crack are observed to be the major sources of failure for the solder joint with Ni–5 wt.%P, whereas, the failure of Ni–10 wt.%P solder joint is accounted for the formation of Ni2SnP, P-rich Ni layer and Kirkendall voids after long term aging.