Analysis and Measurement of Glue-Spall Stresses in Glass-Epoxy Bonds
Analysis and Measurement of Glue-Spall Stresses in Glass-Epoxy Bonds
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玻璃-环氧树脂粘结中胶剥落应力的分析和测量
DOI：
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发表时间：
1982
期刊：
影响因子：
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通讯作者：
H. Hagy
中科院分区：
文献类型：
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作者：
S. Gulati;H. Hagy
提出了一种近似分析的有机密封剂在玻璃基板上，它坚持引入的胶剥落应力。将该分析结果与有限元法得到的结果进行了比较，并与T=25至−78°C冷却过程中玻璃的光弹性测量结果进行了比较。如果适当考虑有机密封剂蠕变引起的应力释放，理论与实验结果吻合较好。最小化胶剥落应力的方法进行了概述。
An approximate analysis is presented of the glue-spall stresses introduced by an organic sealant in the glass substrate to which it adheres. The results given by this analysis are compared with those obtained by the finite element method, as well as with the photoelastic measurements in glass at T=25 to −78°C during cooling. Good agreement is found between theory and experiment, if proper account is taken of the stress release due to creep of the organic sealant. Methods for minimizing glue-spall stresses are outlined.