Effect of Solute Clusters on Stress Relaxation Behavior in Cu-Ni-P Alloys
Effect of Solute Clusters on Stress Relaxation Behavior in Cu-Ni-P Alloys
复制标题
溶质团簇对 Cu-Ni-P 合金应力松弛行为的影响
DOI：
10.1007/s11661-009-0025-9
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发表时间：
2009
期刊：
影响因子：
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通讯作者：
G. Smith
中科院分区：
文献类型：
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作者：
Y. Aruga;D. Saxey;E. Marquis;H. Shishido;Y. Sumino;A. Cerezo;G. Smith
本文采用三维原子探针（3DAP）和透射电子显微镜（TEM）对Cu-P和Cu-Ni-P合金中的超细结构进行了表征，并探讨了这些合金的应力松弛行为。结果表明，低温退火显著提高了Cu-Ni-P合金的应力松弛性能，尤其是Cu-Ni-P合金。结果表明，在Cu-Ni-P合金中存在Ni-P团簇。在这些材料中的位错密度和溶质原子簇密度的变化方面的性能的整体改善进行了分析。结果表明，具有小的平均间距的集群引起的应力松弛性能的显着改善，而不需要显着的位错密度的变化。
In this study, the ultrafine structures in Cu-P and Cu-Ni-P alloys have been characterized using a three-dimensional atom probe (3DAP) and transmission electron microscopy (TEM), and the stress relaxation behavior of these alloys has been explored. The results show that low-temperature annealing greatly improved the stress relaxation performance, especially in the Cu-Ni-P alloys. The presence of Ni-P clusters in the Cu-Ni-P alloys has been revealed. The overall improvement in properties has been analyzed in terms of variations in the dislocation density and solute atom cluster density within these materials. It is shown that clusters with small average spacing give rise to significant improvements in the stress relaxation performance, without requiring significant change in the dislocation density.
透射电子显微镜
DOI：
10.1007/978-3-319-26651-0_3
发表时间：
2016
期刊：
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影响因子：
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作者：
Burke M
通讯作者：
Burke M