Polyimide/POSS nanocomposites: interfacial interaction, thermal properties and mechanical properties
Polyimide/POSS nanocomposites: interfacial interaction, thermal properties and mechanical properties
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DOI：
10.1016/s0032-3861(03)00434-8
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发表时间：
2003-07-01
期刊：
影响因子：
4.6
通讯作者：
Siow, YP
中科院分区：
文献类型：
--
作者：
Huang, JC;He, CB;Siow, YP
采用两步法制备了一系列功能性多面体低聚物倍半硅氧烷（POSS）/聚酰亚胺（PI）纳米复合材料，首先，将八（氨基苯基）倍半硅氧烷（OAPS）/NMP溶液与4,4'-二氨基二苯甲烷和3,3',4,4'-二苯甲酮四甲酸二酐在NMP中反应制备的聚酰胺酸（PAA）溶液混合，其次，对缩聚溶液进行热酰亚胺化处理。明确的“硬颗粒”(POSS) 以及 PI 和“硬颗粒”之间的强共价键导致所得纳米复合材料的热机械性能显着改善。由于 PI-POSS 纳米复合材料中交联密度的显着增加，玻璃化转变温度显着升高，而热膨胀系数 (CTE) 降低。纳米复合材料的热稳定性和机械性能也得到改善。 (C) 2003 年，爱思唯尔科学有限公司出版。
A series of functional polyhedral oligomer silsesquioxnae, (POSS)/polyimide (PI) nanocomposites were prepared using a two-step approach, first, the octa(aminophenyl)silsesquioxane (OAPS)/NMP solution was mixed with polyamic acid (PAA) solution prepared by reacting 4,4'-diaminodiphenylmethane and 3,3',4,4'-benzophenonetetracarboxylic dianhydride in NMP, and second, the polycondensation solution was treated by thermal imidization. The well-defined 'hard particles' (POSS) and the strong covalent bonds between the PI and the 'hard particles' lead to a significant improvement in the thermal mechanical properties of the resulting nanocomposites. The glass transition temperature dramatically increases while the coefficient of thermal expansion (CTE) decreases, owing to the significant increase of the cross-linking density in the PI-POSS nanocomposites. The thermal stability and mechanical property of the nanocomposites were also improved. (C) 2003 Published by Elsevier Science Ltd.