Supercomputer Fugaku CPU A64FX Realizing High Performance, High-Density Packaging, and Low Power Consumption
Supercomputer Fugaku CPU A64FX Realizing High Performance, High-Density Packaging, and Low Power Consumption
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实现高性能、高密度封装、低功耗的超级计算机富岳CPU A64FX
DOI：
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发表时间：
2020
期刊：
影响因子：
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通讯作者：
Yuichiro Ajima
中科院分区：
文献类型：
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作者：
R. Okazaki;T. Tabata;Sota Sakashita;K. Kitamura;Noriko Takagi;Hideki Sakata;T. Ishibashi;Takeo Nakamura;Yuichiro Ajima
A64FX是为超级计算机Fugaku开发的处理器。半导体方面，采用了台积电[1]的7纳米CMOS工艺技术。为了实现更高的密度，在CPU芯片中实现了豆腐互连D和PCI Express控制器，并在封装中集成了高带宽3D堆叠存储器。A64FX采用Arm架构来改善软件开发环境，同时继承富士通成熟的高性能微架构。此外，我们作为Arm有限公司的主要合作伙伴，致力于可扩展向量扩展（SVE）的规范，其成果已被采用。本文概述了A64FX并介绍了它的高性能微架构，架构实现了高密度封装
The A64FX was developed as a processor for the supercomputer Fugaku. For the semiconductors, the 7-nm CMOS process technology of TSMC [1] has been used. For higher density, the Tofu interconnect D and the PCI Express controllers have been implemented in the CPU chip, and the high-bandwidth 3D stacked memory is integrated in the package. The A64FX employs the Arm architecture to improve the software development environment while inheriting Fujitsu’s proven high-performance microarchitecture. In addition, we worked on the specifica - tion of Scalable Vector Extension (SVE) as a lead partner of Arm Limited, the result of which has been adopted. This article outlines the A64FX and describes its high-performance microarchitecture, architecture to achieve high-density packaging