Syringe-injectable electronics.

Syringe-injectable electronics.
复制标题

DOI:
10.1038/nnano.2015.115
复制
发表时间:
2015-07
影响因子:
38.3
通讯作者:
Lieber CM
Lieber CM
中科院分区:
材料科学1区
文献类型:
--
作者:
Liu J;Fu TM;Cheng Z;Hong G;Zhou T;Jin L;Duvvuri M;Jiang Z;Kruskal P;Xie C;Suo Z;Fang Y;Lieber CM

文献摘要

被引文献

相似文献

人造或自然结构内电子器件的无缝和微创三维(3D)相互渗透可以允许对其属性进行连续监测和操纵。柔性电子器件提供了用于使电子器件符合非平面表面的手段,然而将柔性电子器件定向递送到内部区域仍然是困难的。在这里,我们通过演示注射器注射和随后通过直径小至100微米的针展开亚微米厚的厘米级大孔网状电子器件来克服这一挑战。我们的研究结果表明,电子元件可以注入到人造和生物腔体,以及致密的凝胶和组织中,器件产率> 90%。我们展示了注射器可注射电子器件的几种应用,作为具有3D结构的互穿柔性电子器件的一般方法,包括(i)监测聚合物腔中的内部机械应变,(ii)与大脑的几个不同区域的紧密整合和低慢性免疫反应性,以及(iii)体内多路复用神经记录。此外,注射器注射使得能够通过刚性壳体递送柔性电子器件,递送可以填充内腔的大体积柔性电子器件,以及将电子器件与其他材料共注射到主体结构中,从而为柔性电子器件开辟了独特的应用。
Seamless and minimally-invasive three-dimensional (3D) interpenetration of electronics within artificial or natural structures could allow for continuous monitoring and manipulation of their properties. Flexible electronics provide a means for conforming electronics to non-planar surfaces, yet targeted delivery of flexible electronics to internal regions remains difficult. Here, we overcome this challenge by demonstrating syringe injection and subsequent unfolding of submicrometer-thick, centimeter-scale macroporous mesh electronics through needles with a diameter as small as 100 micrometers. Our results show that electronic components can be injected into man-made and biological cavities, as well as dense gels and tissue, with > 90% device yield. We demonstrate several applications of syringe injectable electronics as a general approach for interpenetrating flexible electronics with 3D structures, including (i) monitoring of internal mechanical strains in polymer cavities, (ii) tight integration and low chronic immunoreactivity with several distinct regions of the brain, and (iii) in vivo multiplexed neural recording. Moreover, syringe injection enables delivery of flexible electronics through a rigid shell, delivery of large volume flexible electronics that can fill internal cavities and co-injection of electronics with other materials into host structures, opening up unique applications for flexible electronics.