Heat-cycle endurance and in-plane thermal expansion of Al2O3/Al substrates formed by aerosol deposition method
Heat-cycle endurance and in-plane thermal expansion of Al2O3/Al substrates formed by aerosol deposition method
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DOI：
10.2109/jcersj2.116.1299
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发表时间：
2008-12-01
影响因子：
1.1
通讯作者：
Tsurumi, Takaaki
中科院分区：
文献类型：
--
作者：
Sakamaki, Ryo;Hoshina, Takuya;Tsurumi, Takaaki
提出了一种利用气溶胶沉积法在铝基片上制备Al 2 O3厚膜的大功率模块散热基板。在室温条件下，采用ADM法可以得到致密的Al_2O_3厚膜（AD-Al_2 O_3）。在-80 ℃和180 ℃之间的热循环耐久性测试显示，AD-Al 2 O 3/Al基板优于使用结合到Al基板的AlN陶瓷的常规直接钎焊铝（DBA）基板上级。热循环后，尽管Al 2 O3和Al的热膨胀系数不同，但AD-Al 2 O3薄膜与Al基体之间没有分层现象，AD-Al 2 O3薄膜的面内热膨胀系数与Al基体的面内热膨胀系数基本相同，表明在由纳米颗粒组成的AD-Al_2 O_3薄膜中发生了塑性变形，尺寸的晶粒，以缓解由热膨胀系数的差异引起的应力。(c)2008年，日本陶瓷协会。All rights reserved.
A new heat radiation substrate for high power modules has been proposed by utilizing Al2O3 thick films formed by the aerosol deposition method (ADM) on Al substrates. Dense Al2O3 thick films (AD-Al2O3) could be obtained by the ADM at room temperature. A heat-cycle endurance test between -80 degrees C and 180 degrees C revealed that the AD-Al2O3/Al substrates were superior to the conventional direct brazed aluminum (DBA) substrates using AlN ceramics bounded to Al substrates. No lamination was observed between the AD-Al2O3 films and Al substrates after heat-cycle test in spite of the difference of thermal expansion coefficient between Al2O3 and Al. The in-plane thermal expansion coefficient of AD-Al2O3 films was almost the same as that of Al substrates, indicating that plastic deformation was induced in the AD-Al2O3 films consisting of nano-sized grains to relax the stress caused by the difference of thermal expansion coefficient. (c) 2008 The Ceramic society of Japan. All rights reserved.