Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses
Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses
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DOI：
10.1143/apex.1.082601
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发表时间：
2008-08
影响因子：
2.3
通讯作者：
Y. Ozeki;Tomoyuki Inoue;T. Tamaki;H. Yamaguchi;S. Onda;W. Watanabe;T. Sano;S. Nishiuchi;A. Hirose;K. Itoh
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文献类型：
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作者：
Y. Ozeki;Tomoyuki Inoue;T. Tamaki;H. Yamaguchi;S. Onda;W. Watanabe;T. Sano;S. Nishiuchi;A. Hirose;K. Itoh
我们展示了玻璃和铜基板之间的直接微焊接使用飞秒（fs）脉冲。接头强度大于16 MPa。样品的扫描电子显微镜横截面图像证明了成功的连接，没有空隙或裂纹。此外，我们表明，与ns-脉冲相比，使用fs-脉冲可以减少焊接所需的脉冲能量的两个数量级，导致抑制热效应和精确控制的焊接区域。
We demonstrate direct microwelding between glass and copper substrates by use of femtosecond (fs) pulses. The joint strength is as high as >16 MPa. A scanning electron microscopy cross-sectional image of the sample proves successful joining without voids or cracks. Furthermore, we show that, compared with ns-pulses, the use of fs-pulses can reduce the pulse energy required for welding by two orders of magnitude, leading to the suppressed effect of heat and to the precise control of the welded region.