Nanoindentation load-displacement behavior of pure face centered cubic metal thin films on a hard substrate
Nanoindentation load-displacement behavior of pure face centered cubic metal thin films on a hard substrate
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DOI：
10.1016/s0040-6090(00)01907-6
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发表时间：
2001-04-02
期刊：
影响因子：
2.1
通讯作者：
Yoshida, T
中科院分区：
文献类型：
--
作者：
Ohmura, T;Matsuoka, S;Yoshida, T
在蓝宝石单晶上沉积的0.1-3 μ m纯铝、金和铂薄膜上进行了纳米压痕试验。采用三种不同的试验设备对荷载P-侵彻深度h曲线进行了分析，以研究其变形特性。对于使用布氏压头的情况，在比膜厚约1/5深的穿透深度范围内，膜的塑性变形受到硬基底的约束。铝膜的弹入现象通常被认为是由膜表面的自然氧化层引起的，因为在压痕测试期间，这样厚的膜可能不会发生脱粘。设备依赖性的推导结果被发现是允许的实验误差的限制内。(C)2001 Elsevier Science B. V.保留所有权利。
Nanoindentaion tests have been performed on 0.1-3 mum pure aluminum, gold and platinum thin films deposited on sapphire single crystals. The load P-penetration depth h curves have been analyzed by three different kinds of equipment in order to investigate the deformation behavior. The plastic deformation of films is constrained by the hard substrate in the penetration depth range deeper than approximately 1/5 of film thickness for the case of using Berkovich indenter. The pop-in phenomenon often found for the case of aluminum films is considered to be caused by the natural oxide laver on the film surface, since decohesion of such thick films might not occur during the indentation testing. Equipment dependence of the derived results is found to be allowed within the limit of experimental error. (C) 2001 Elsevier Science B.V. All rights reserved.