Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
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使用多入口/出口歧管改善针翅式散热器的传热和流量分布
DOI：
10.1115/1.4054461
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发表时间：
2022
影响因子：
1.6
通讯作者：
Sammakia, Bahgat G.
中科院分区：
文献类型：
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作者：
Gharaibeh, Ahmad R.;Manaserh, Yaman M.;Tradat, Mohammad I.;AlShatnawi, Firas W.;Schiffres, Scott N.;Sammakia, Bahgat G.
高功率电子元件的不断小型化和不断增加的功耗对其热管理提出了许多挑战。为了提高这些设备的效率和可靠性，必须适当地去除它们产生的大量热量。本文建立了一个三维数值模型，并对几种不同的散热器设计进行了实验验证。其目标是提高散热器的热性能，同时通过降低散热器两端的压降来降低所需的泵浦功率。所考虑的设计以商业上可用的散热器为基准，其热力和水力性能。所提出的歧管被设计成通过交替的入口和出口分支内部通道来分配流体。结果表明，采用三通道歧管设计，使冷板的热阻从0.061 °C/W降至0.054 °C/W，压降降低0.77 kPa.通过几何参数研究，研究了歧管内部流道宽度对设计方案热工水力性能的影响。研究发现，热阻随着歧管通道宽度的减小而减小，直到某一宽度值后，热阻才开始增大，同时保持较低的压降。其中，在7个通道设计中，热阻显著降低了16.4%，并将较低的压降值维持在0.6 kpa以下。
The increased power consumption and continued miniaturization of high-powered electronic components have presented many challenges to their thermal management. To improve the efficiency and reliability of these devices, the high amount of heat that they generate must be properly removed. In this paper, a three-dimensional numerical model has been developed and experimentally validated for several manifold heat sink designs. The goal was to enhance the heat sink's thermal performance while reducing the required pumping power by lowering the pressure drop across the heat sink. The considered designs were benchmarked to a commercially available heat sink in terms of their thermal and hydraulic performances. The proposed manifolds were designed to distribute fluid through alternating inlet and outlet branched internal channels. It was found that using the manifold design with 3 channels reduced the thermal resistance from 0.061 to 0.054 °C/W with a pressure drop reduction of 0.77 kPa from the commercial cold plate. A geometric parametric study was performed to investigate the effect of the manifold's internal channel width on the thermohydraulic performance of the proposed designs. It was found that the thermal resistance decreased as the manifold's channel width decreased, up until a certain width value, below which the thermal resistance started to increase while maintaining low-pressure drop values. Where the thermal resistance significantly decreased in the 7 channels design by 16.4% and maintained a lower pressure drop value below 0.6 kPa.