Focused-ion-beam-introduced stress as a driving force for three-dimensional micro/nano-assembly

Focused-ion-beam-introduced stress as a driving force for three-dimensional micro/nano-assembly
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DOI:
10.1016/j.sna.2022.114118
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发表时间:
2022-12
期刊:
Sensors and Actuators A: Physical
影响因子:
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通讯作者:
Shengxiao Jin;L. Xia;Y. Mao;Xiaoyu Chen;Zhuojie Chen;Can Li;Wengang Wu;Jun Xu
Shengxiao Jin;L. Xia;Y. Mao;Xiaoyu Chen;Zhuojie Chen;Can Li;Wengang Wu;Jun Xu
中科院分区:
其他
文献类型:
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作者:
Shengxiao Jin;L. Xia;Y. Mao;Xiaoyu Chen;Zhuojie Chen;Can Li;Wengang Wu;Jun Xu

文献摘要

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在Si3N4、SiO_2、晶体-Si、多晶硅、Al和Au等材料中,观察到具有keV Ga+的聚焦离子束(FIB)能够在材料中引入纳米尺度的局域拉应力。这种应力被用作将独立的二维(2D)纳米薄膜图案组装成三维(3D)结构的驱动力。演示了二维图形从0°到90°的连续弯曲。提出了一个应变双层系统模型来定性地描述弯曲角度。采用FIB应力诱导变形(FIB-SID)技术和适当的应力引入策略,实现了三维立方体框架和螺旋线的制造。为了证明FIB-SID的能力,我们制作了由立体式3D裂环谐振器(SRR)组成的立体超材料,在红外区域表现出相当大的光吸收。理论和实验结果表明,超材料器件在5.3微米处具有最小反射率。在此基础上,我们发展了一种可编程的准并行FIB制作方法(以3D SRRS结构为例),该方法具有更高的效率、更好的一致性和相当大的吞吐量。这种技术显示出的灵活性和可控性使其在构建微/纳米机电系统的各种形式的三维微/纳米结构方面具有广阔的前景。
Focused ion beam (FIB) with keV Ga+has been observed to be able to introduce nanoscale localized tensile stress in materials including Si3N4, SiO2, crystal-Si, poly-Si, Al, and Au. Such stress is employed as a driving force to assemble free-standing two-dimensional (2D) nano-film patterns to three-dimensional (3D) structures. Continuous bending from 0° to 90° of the 2D patterns is demonstrated. A strained-bilayer-system model is proposed to qualitatively describe the bending angle. Fabrications of a 3D cubic frame as well as helices are achieved by the FIB stress induced deformation (FIB-SID) technology with proper stress-introducing strategy. To prove the power of FIB-SID, we fabricate stereo metamaterials composed of “standing” 3D split ring resonators (SRR), demonstrating considerable optical absorption in IR regime. Theoretical and experimental results manifest that the metamaterial device has reflection minimum at 5.3 µm. On this basis, we develop a programmable quasi-parallel FIB fabrication method for 3D nanostructure (taking the 3D SRRs structure as an example) which has advantages of much higher efficiency, great consistency and considerable throughput. The revealed flexibility and controllability of this technology make it promising in constructing diverse forms of 3D micro/nano-structures for micro/nano-electromechanical systems.