Modeling and analysis of transient temperature field in finite thickness plate under symmetrically located moving heat sources
Modeling and analysis of transient temperature field in finite thickness plate under symmetrically located moving heat sources
复制标题
对称移动热源下有限厚度板瞬态温度场建模与分析
DOI：
10.1177/1687814015619554
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发表时间：
2015-11
影响因子：
2.1
通讯作者：
Li heyan
中科院分区：
文献类型：
--
作者：
xiong cenbo;Ma biao;Li heyan
本文研究了平板与对称布置的接触垫接触时的热问题。研究了板料厚度、板料移动速度和对流对板料温度场的影响。在此基础上，可以确定适合具体情况的模型和计算方法。采用移动热输入的有限元法计算了温度场，并与已有的解析解进行了比较，验证了计算结果的正确性。结果表明，温度稳定的特征时间可以用运动速度的函数进行指数近似。当板厚小于临界厚度时，表面温度会显著升高，这意味着在这种情况下温度场对板厚非常敏感。随着热源移动速度的增加，表面峰值温度几乎呈线性增加，当热源移动速度较慢时，接触区域外的对流会显著降低表面峰值温度，而当热源移动速度较快时，对流对表面峰值温度几乎没有影响。在此基础上，建立了类似结构温度场研究模型和计算方法的选择准则。
The thermal problem of plate slides against symmetrically located contacting pads is investigated. The aim is to find out the influences of plate thickness, moving speed, and convection on the temperature field of the plate. Proper models and computing methods for specific situations can be determined based on these analyses. Finite element method of moving heat input is used to calculate the temperature field which is validated by comparing with some existing analytical solutions. The results show that the characteristic time for the steady state of temperature can be approximated exponentially as a function of moving speed. If the plate is thinner than the critical thickness, the surface temperature is increased significantly, which means that the temperature field is very sensitive to the plate thickness in this situation. The increasing moving speed increases the peak surface temperature almost linearly, and the convection outside of the contact area can decrease the peak surface temperature significantly if the heat sources move slowly, while it hardly affects the peak surface temperature if the heat sources move fast. Based on these results, the criterion of choosing a model and computing methods for studying the temperature fields in the similar structures is established.
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