Effect of relative tool sharpness on subsurface damage and material recovery in nanometric cutting of mono-crystalline silicon: A molecular dynamics approach
Effect of relative tool sharpness on subsurface damage and material recovery in nanometric cutting of mono-crystalline silicon: A molecular dynamics approach
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DOI：
10.1016/j.mssp.2019.104868
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发表时间：
2020-03-15
影响因子：
4.1
通讯作者：
Yan, Jiwang
中科院分区：
文献类型：
--
作者：
Kalkhoran, Seyed Nader Ameli;Vahdati, Mehrdad;Yan, Jiwang
切削深度（h（0））和刀具刃口半径（r（e））是纳米切削的两个关键参数，同时研究这两个参数可以全面了解纳米切削机理。本文采用分子动力学（MD）模拟方法，以相对刀具锋利度（RTS）h（0）/r（e）为因子，研究了单晶硅纳米切削过程中亚表面损伤和材料回复的变化规律。不同的RTS值产生的变化，切削深度在不同的刀具刃口半径为1，3和5 nm分别。结果表明，即使在RTS = 0时，刀具表面也始终存在一层粘附在刀具表面上的颗粒，从而影响加工表面。此外，RTS的增加导致亚表面损伤层锯齿，这是由刀具与工件之间的粘滑现象引起的。较大的RTS导致较大的锯齿深度，尽管锯齿数量保持不变。RTS的增加也导致六方金刚石结构的形成。随着RTS的增加，物料回收率急剧下降。使用更锋利的刀刃（RTS
Depth of cut (h(0)) and tool edge radius (r(e)) are two key parameters in nanometric cutting, investigating both of the two parameters simultaneously can provide comprehensive understanding of the cutting mechanism. In this paper, relative tool sharpness (RTS), which is quantified as h(0)/r(e), is employed as a factor to examine the sub-surface damage and material recovery in nanometric cutting of mono-crystalline silicon using molecular dynamics (MD) simulation. Various RTS values were generated by changes of cutting depth at different tool edge radius of 1, 3 and 5 nm respectively. Results indicate that there is always a layer of particles which sticks on the tool surface and influences the machined surface, even at RTS = 0. Besides that, the increase of RTS results in subsurface damage layer serration, which is caused by stick-slip phenomenon between the tool and workpiece. A bigger RTS causes a bigger depth of serrations, although the number of serrations remains constant. Increase in RTS also causes the formation of the hexagonal diamond structure. The material recovery drops dramatically by RTS increase. Using a sharper tool edge (RTS