Design, development and tests of a compact thermofluid system
Design, development and tests of a compact thermofluid system
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DOI：
10.1016/j.applthermaleng.2016.02.104
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发表时间：
2016-06
影响因子：
6.4
通讯作者：
S. Cai;Ya-Chi Chen;A. Bhunia
中科院分区：
文献类型：
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作者：
S. Cai;Ya-Chi Chen;A. Bhunia
为了减轻温度超调并消散大功率电子元件产生的高度集中的热量，开发一种超薄蒸汽室/散热器以适应紧凑型3D电子系统是非常重要的。作为一种半导体材料，硅具有高导热性、可微加工性和与微电子制造工艺兼容的特点。因此，硅基蒸汽室（SVC）可以直接与微电子器件集成以实现热点冷却，而无需引入额外的热界面。本文从结构安全分析入手，介绍了SVC的发展，并对其进行了液、气流动的数值模拟。采用先进的多尺度灯芯结构来平衡在重力作用下高热流密度的热量和质量传递。在此基础上，通过三键结合的方法开发了13 × 8柱阵结构增强的SVC。SVCs的研制成功实现了大型（50 mm × 70 mm）和超薄（1 mm厚）相变换热装置，有效密度小于1.5 × 103kg/m3。实验证明，在一维和二维传热模式下，水作为工作流体的有效导热系数均超过10,000 W/m·K。
To mitigate temperature overshoot and dissipate highly concentrated heat from high-power electronic components, it is important to develop an ultrathin vapor chamber/heat spreader to fit in a compact 3D electronic system. As a semiconductor material, silicon is highly thermal conductive, micromachinable and process-compatible with microelectronic manufactures. Thus, a silicon based vapor chamber (SVC) can be directly integrated with microelectronic devices to achieve hot spot cooling, without introducing an additional thermal interface. This article reports the development of SVC, stating from analysis of structural safety, followed by numerical simulations of the liquid and vapor flows. Advanced multiscale wick structures are implemented to balance the heat and mass transports of high heat flux under a gravitational force. On these bases, SVC with structural reinforcement of a 13 × 8 pillar array is developed through a triple bonding approach. The successful development of the SVCs results in a large scale (50 mm × 70 mm) and ultrathin (1 mm thick) phase change heat transfer device, with the effective density less than 1.5 × 103kg/m3. Using water as the operating fluid, we experimentally demonstrate a high effective thermal conductivity over 10,000 W/m⋅K in both 1D and 2D heat transfer modes.