Microstructure and Interfacial Reactions During Vacuum Brazing of Stainless Steel to Titanium Using Ag-28 pct Cu Alloy
Microstructure and Interfacial Reactions During Vacuum Brazing of Stainless Steel to Titanium Using Ag-28 pct Cu Alloy
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DOI：
10.1007/s11661-014-2671-9
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发表时间：
2015-02-01
影响因子：
2.8
通讯作者：
Dey, G. K.
中科院分区：
文献类型：
--
作者：
Laik, A.;Shirzadi, A. A.;Dey, G. K.
研究了用Ag-28wt%Cu共晶合金真空钎焊2级Ti和304 L不锈钢的组织演变和界面反应。在钎焊区（BZ）的SS侧上形成-Fe（Cr，Ni）固溶体的薄Ni贫化区。来自钎焊合金的Cu与来自基体材料的溶解的Fe和Ti结合，形成了一层三元化合物，邻近BZ中的Ti。此外，四个二元金属间化合物，CuTi，CuTi，CuTi和CuTi形成平行连续层中的BZ。未反应的Ag固化为CuTi和CuTi层内的岛。在BZ的某些位置形成的非晶相可以被揭示。由于Cu扩散到Ti基材料中而形成的-Ti（Cu）层转变为具有层状形貌的-Ti + CuTi共析体。拉伸试验表明，钎焊接头的强度为112 MPa，在BZ处失效。描绘了导致这些接头的最终微观结构和失效模式的事件的可能顺序。
Microstructural evolution and interfacial reactions during vacuum brazing of grade-2 Ti and 304L-type stainless steel (SS) using eutectic alloy Ag-28 wt pct Cu were investigated. A thin Ni-depleted zone of -Fe(Cr, Ni) solid solution formed on the SS-side of the braze zone (BZ). Cu from the braze alloy, in combination with the dissolved Fe and Ti from the base materials, formed a layer of ternary compound , adjacent to Ti in the BZ. In addition, four binary intermetallic compounds, CuTi, CuTi, CuTi and CuTi formed as parallel contiguous layers in the BZ. The unreacted Ag solidified as islands within the layers of CuTi and CuTi. Formation of an amorphous phase at certain locations in the BZ could be revealed. The -Ti(Cu) layer, formed due to diffusion of Cu into Ti-based material, transformed to an -Ti + CuTi eutectoid with lamellar morphology. Tensile test showed that the brazed joints had strength of 112 MPa and failed at the BZ. The possible sequence of events that led to the final microstructure and the mode of failure of these joints were delineated.