Thermally cross-linkable host materials for enabling solution-processed multilayer stacks in organic light-emitting devices

Thermally cross-linkable host materials for enabling solution-processed multilayer stacks in organic light-emitting devices
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DOI:
10.1016/j.orgel.2013.03.028
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发表时间:
2013-06
影响因子:
3.2
通讯作者:
Naoya Aizawa;Yong‐Jin Pu;Hisahiro Sasabe;J. Kido
Naoya Aizawa;Yong‐Jin Pu;Hisahiro Sasabe;J. Kido
中科院分区:
工程技术3区
文献类型:
--
作者:
Naoya Aizawa;Yong‐Jin Pu;Hisahiro Sasabe;J. Kido

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A thermally cross-linkable host material, i.e., two vinylbenzyl ether groups containing a carbazole derivative (DV-CBP), was developed for solution-processed multilayer organic light-emitting devices (OLEDs). DV-CBP was thermally cross-linked at styrene end-groups through curing at approximately 180°C in the absence of a polymerization initiator. This cross-linking reaction rendered the emissive layer insoluble and enabled the subsequent solution deposition of an upper electron-transporting layer. Furthermore, photoluminescence quantum efficiencies of the emissive layer were maintained at greater than 75% throughout the cross-linking reaction. A solution-processed small-molecule electron-transporting layer on top of the cross-linked emissive layer led to lower driving voltages and higher efficiencies in the OLEDs compared to those of a device with a vacuum-deposited Ca electrode on the emissive layer.