Properties of Films Prepared on Buffered Ni-Electroplated Cu Tapes
Properties of Films Prepared on Buffered Ni-Electroplated Cu Tapes
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DOI：
10.1109/tasc.2009.2018796
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发表时间：
2009-06
影响因子：
1.8
通讯作者：
M. Tokudome;T. Doi;R. Tomiyasu;M. Daio;Y. Hakuraku;K. Shima;S. Kubota;N. Kashima;S. Nagaya
中科院分区：
文献类型：
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作者：
M. Tokudome;T. Doi;R. Tomiyasu;M. Daio;Y. Hakuraku;K. Shima;S. Kubota;N. Kashima;S. Nagaya
铜基板的优点是没有铁磁的贡献滞后交流损耗，和低成本的镍基板。研究了在立方织构Cu带上沉积的YBCO薄膜的性质。通过电镀在立方织构Cu带的顶部添加保护性Ni覆盖层以降低Cu基底的氧化速率。在缓冲的Ni电镀Cu带上制备的YBCO薄膜在77 K时在自场中的输运超过3.6。我们还证实，我们的镍电镀铜磁带失去了热处理后的铁磁性。铜带，电镀，高温超导，。
The Cu substrates have the advantages of no ferro- magnetic contribution to hysteretic AC losses, and low cost com- pared to Ni substrates. We investigated the properties of YBCO films deposited on the cube-textured Cu tapes with inter- vening buffer layers. A protective Ni overlayer was added on top of the cube-textured Cu tape by electroplating to reduce the oxi- dation rate of the Cu substrate. The YBCO films prepared on the buffered Ni-electroplated Cu tapes revealed the transport exceeding 3.6 at 77 K in a self-field. We also confirmed that our Ni-electroplated Cu tape lost its ferro- magnetism after heat treatment. Index Terms—Cu tapes, electroplating, high-temperature super- conductors, .