Ceramic toughness assessment through edge chipping measurements—Influence of interfacial friction
Ceramic toughness assessment through edge chipping measurements—Influence of interfacial friction
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DOI：
10.1016/j.jeurceramsoc.2009.01.019
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发表时间：
2009-08
影响因子：
5.7
通讯作者：
F. Petit;V. Vandeneede;F. Cambier
中科院分区：
文献类型：
--
作者：
F. Petit;V. Vandeneede;F. Cambier
本文介绍了通过边缘碎裂测量确定材料韧性的两种技术之间的比较研究。第一种技术依赖于静态洛氏压痕，在距离边缘明确的距离处进行，载荷不断增加，直到发生碎裂。第二种技术保持所施加的载荷恒定，但以恒定的速度驱动洛氏压头朝向边缘，直到形成芯片（划痕测试）。在大多数研究情况下，我们对陶瓷的实验结果与文献中先前模型的预测一致，该模型通过[公式：见正文]表示韧性KIcas是切屑尺寸Ic和临界切屑载荷P的函数。然而，对于碳化硅，通过该方法的两种变体获得的韧性值是相互不相容的。这种差异与划痕试验过程中发生的切向载荷有关。一个新的方程的韧性评估推导出，考虑到摩擦的影响。该方程与静态压痕和滑动压痕的实验结果吻合较好。
In this paper, a comparative study between two techniques to determine material toughness through edge chipping measurements, is presented. The first technique relies on static Rockwell indentations, performed at well-defined distances from the edge with an increasing load until chipping occurs. The second technique keeps the applied load constant but drives the Rockwell indenter towards the edge at constant speed until a chip is formed (scratch testing). In most studied cases, our experimental results on ceramics are shown to conform with the predictions of previous models in the literature expressing the toughness KIcas a function of chip size lcand critical chipping load P through [Formula: see text] . However, for silicon carbide, the toughness values obtained by both variants of the method are mutually incompatible. The discrepancy is shown to be related to the tangential loading occurring during scratch testing. A new equation for toughness assessment is derived that takes into account the influence of friction. This equation is demonstrated to match well the experimental results both for static and sliding indentation.