Thermomechanical modelling and reliability study of an IGBT module for an aeronautical application
Thermomechanical modelling and reliability study of an IGBT module for an aeronautical application
复制标题
航空应用 IGBT 模块的热机械建模和可靠性研究
DOI：
--
复制
发表时间：
2008
期刊：
影响因子：
--
通讯作者：
M. Mermet
中科院分区：
文献类型：
--
作者：
A. Zéanh;O. Dalverny;M. Karama;E. Woirgard;S. Azzopardi;A. Bouzourene;J. Casutt;M. Mermet
本文采用非线性有限元分析方法对一种航空用IGBT（绝缘栅双极型晶体管）模块进行了研究。两种失效模式被认为是：脆性材料断裂和焊点热机械疲劳。在真实的载荷分布下，对应用所需的40000次飞行循环进行了关于这些失效模式的模块可靠性评估。还计算了模块设计鉴定和确认期间使用的加速热循环（ATC）的加速因子（AF）。
In this paper, an IGBT (Insulated Gate Bipolar Transistor) module for an aeronautic application was investigated using non-linear Finite Element Analysis (FEA). Two failure modes were considered: brittle materials fracture and solder joint thermomechanical fatigue. The module reliability regarding these failure modes was evaluated over the 40000 flight cycles required for the application, under the real loading profile. Acceleration Factors (AF) were also computed with respect to Accelerated Thermal Cycling (ATC) used during the module design qualification and validation.