Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro joints
Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro joints
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DOI：
10.1016/j.matchemphys.2017.01.022
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发表时间：
2017-04
影响因子：
4.6
通讯作者：
H. W. Yang;J. Y. Wu;Z. X. Zhu;C. Kao
中科院分区：
文献类型：
--
作者：
H. W. Yang;J. Y. Wu;Z. X. Zhu;C. Kao
微电子工业中的微连接中经常会出现大量的空洞。为了设计适当的策略来抑制这些空隙的形成，需要对空隙形成机制的理解。在这项研究中使用的Ni/Sn/Ni系统，以确定表面扩散和反应引起的体积收缩的影响。研究结果表明，反应引起的体积收缩是影响材料力学性能的主要因素。表面扩散对微接头的表面形貌有很大的影响。此外，第一次在一个微连接的三维空隙分布是通过使用顺序离子束横截面。
Considerable amounts of voids are often observed in micro joints used in microelectronic industry. To devise proper strategies to suppress the formation of these voids requires an understanding of the void formation mechanism. The Ni/Sn/Ni system is used in this study to determine the effects of surface diffusion and reaction-induced volume shrinkage. It is confirmed out that the reaction-induced volume shrinkage plays an important role. Surface diffusion has a strong effect on the surface morphology of the micro joints. Additionally, for the first time the three dimensional void distribution in a micro joint is uncovered by using sequentially ion beam cross-sectioning.