Application-independent defect tolerance of reconfigurable nanoarchitectures
Application-independent defect tolerance of reconfigurable nanoarchitectures
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DOI：
10.1145/1167943.1167945
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发表时间：
2006-07
期刊：
影响因子：
--
通讯作者：
M. Tahoori
中科院分区：
文献类型：
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作者：
M. Tahoori
自组装纳米制造工艺产生规则和可重构的器件。然而，这种新兴纳米技术的缺陷密度高于传统的基于光刻技术的超大规模集成电路。在本文中，我们提出了一个独立于应用程序的容错设计流程，以最大限度地减少每个芯片执行的定制后期设计工作。在这个流程中，不需要更高层次的设计步骤来了解芯片中缺陷的存在和位置。只有最后的映射步骤才需要缺陷意识。该流程的应用独立性最大限度地减少了每个芯片设计步骤的数量，使其适合大批量生产。我们还提出了递归和贪心两种映射算法，将不存在缺陷的设计步骤与最终存在缺陷的映射步骤联系起来。实验表明，贪心算法得到的结果非常接近精确解。利用这些算法，分析了不同缺陷分布模型下分子横条的制造良率。我们报告了要制造的最小横杆的尺寸，这样可以在保证制造成品率的情况下找到理想尺寸的无缺陷横杆。
Self-assembled nanofabrication processes yield regular and reconfigurable devices. However, defect densities in this emerging nanotechnology are higher than those in conventional lithography-based VLSI. In this article, we present an application-independent defect tolerant design flow to minimize customized postfabrication design efforts to be performed per chip. In this flow, higher level design steps are not needed to be aware of the existence and the location of defects in the chip. Only a final mapping step is required to be defect aware. Application independence of this flow minimizes the number of per-chip design steps, making it appropriate for high volume production. We also present two mapping algorithms, recursive and greedy, which make the connection between defect-unaware design steps and the final defect-aware mapping step. Experiments show that the results obtained by the greedy algorithm are very close to the exact solutions. Using these algorithms, we analyze the manufacturing yield of molecular crossbars under different defect distribution models. We report on the size of the minimum crossbar to be fabricated such that a defect-free crossbar of the desirable size can be found with a guaranteed manufacturing yield.