An analytical model for shear-enhanced adhesiveless transfer printing
An analytical model for shear-enhanced adhesiveless transfer printing
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DOI:
10.1016/j.mechrescom.2012.02.011
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发表时间:
2012-07-01
影响因子:
2.4
通讯作者:
Rogers, John A.
中科院分区:
文献类型:
--
作者:
Cheng, Huanyu;Wu, Jian;Rogers, John A.
Transfer printing is an important technique for assembling micro/nanomaterials on unusual substrates, with promising applications in the fabrication of stretchable and flexible electronics designed for use in areas such as biomedicine. The process involves retrieval of structures (e.g., micro-devices) from their growth (donor) substrate via an elastomeric stamp (i.e.. an element with posts on its surface), and then delivers them onto a different (receiver) substrate. An analytical mechanics model is developed to identify the key parameters for a shear-enhanced mode for transfer printing. The results predict that the pull-off force decreases linearly with increasing shear strain in the post, or with shear displacement across the stamp. This prediction agrees well with the experiments. Published by Elsevier Ltd.