Mutual Coupling Reduction for High-Performance Densely Packed Patch Antenna Arrays on Finite Substrate
Mutual Coupling Reduction for High-Performance Densely Packed Patch Antenna Arrays on Finite Substrate
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DOI：
10.1109/tap.2016.2535540
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发表时间：
2016-05-01
影响因子：
5.7
通讯作者：
Shafique, M. Farhan
中科院分区：
文献类型：
--
作者：
Qamar, Zeeshan;Naeem, Umair;Shafique, M. Farhan
本文报告了一种有效的互耦合抑制技术，其中将超材料覆盖层放置在密集封装的微带相控阵的元件之间。改进的互补开口环谐振器印刷在去耦顶板上，可满足表面波和空间波效应。在低介电常数和高介电常数衬底上对所提出的方案进行了详细分析。在低介电常数和高介电常数基板上分别通过实验实现了 27 和 11 dB 的耦合抑制，元件间距为 lambda(o)/8。该设计结构紧凑，易于实现，并且消除了先前报道的其他解耦技术中前后比较差的缺点。除了高耦合抑制之外，还可以实时添加或删除去耦板，这使得该技术适用于具有严格性能要求的各种应用。
This paper reports on an effective mutual coupling suppression technique in which a metamaterial superstrate is placed in between the elements of densely packed microstrip phased array. Modified complementary split ring resonators are printed on the decoupling superstrate slab which caters for both surface and space wave effects. A detailed analysis of this proposed scheme is carried out on a low as well as on a high-permittivity substrate. Coupling suppression of 27 and 11 dB is achieved experimentally on the low-and high-permittivity substrates, respectively, with an element separation of lambda(o)/8. The design is compact and easy to realize and it removes drawback of poor front-to-back ratio previously reported in other decoupling techniques. In addition to high-coupling suppression, the decoupling slab can be added or removed in real time which makes this technique versatile for various applications having stringent performance requirements.